SEMICON West 2016
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Philippe Absil Ph.D.
Event Details
Compound Semiconductors: Enabling Next Generation Computing and Communications
Next Generation Silicon Photonics for Computing and Communication- Philippe Absil, imec
JULIE ADAMS
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World of IoT: From Sensors to Automation—IoT Enbabled Smart Manufacturing
Julie Adams & Simon Tam, Ubotics
Stacy Ajouri
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Test Vision 2020
Arnold Alderman
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Packaging Power - Enabling a Variety of Applications and Efficiency
Unmet Challenges of Embedded Components for 3D Power Electronics Packaging- Arnold Alderman, Anagenesis
Michael Alfano
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Test Vision 2020
Azar Alizadeh
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Next Generation Flexible Health Monitoring Devices
Manufacturing of Wearable Sensors for Human Health and Performance Monitoring- Azar Alizadeh, GE Global Research
Tim Archer
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CONNECT Executive Summit
Dave Armstrong
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Test Vision 2020
Session 2: Thermal Testing of Singulated Devices Gets Us Closer to Known-Good Die/Stack - Dave Armstrong, Advantest
Ahmad Bahai Ph.D.
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Analog and New Frontiers: Market Drivers, the Applications and Design requirements, and the Supply Chain Challenges
Innovation in Power Semiconductor- Ahmad Bahai, Texas Instruments
Krishnamoorthy Balachandran
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Test Vision 2020
Aditi Banerjee Ph.D.
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Women in Technology Forum
Srinivasa Banna
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Materials: Manufacturing Challenges and Realities at Advanced Nodes
Challenges & Realities of Advanced Node Manufacturing- Srinivasa Banna, GLOBALFOUNDRIES
Ivor Barber
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SiP Next 2 - IoT & Smart Things - SiP Integration
Opportunities for Integration in IoT- Ivor Barber, Xilinx
Denis Barbini Ph.D.
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Packaging Developments for Flexible Hybrid Electronics
Developing the Next Generation Catheter- Denis Barbini, Universal Instruments
Richard Barnett
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Best of West Showcase
SPTS’ Rapier-300S for Plasma Dicing After Grind for 300mm Wafers- Richard Barnett, SPTS Technologies
Francois Beauchaud
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World of IoT: From Sensors to Automation—IoT Enbabled Smart Manufacturing
Smart Sensing for IoT- Francois Beauchaud, Bosch Sensortec
Christophe Begue
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World of IoT: IoT Ready? Deploying Big Data, Analytics, IoT Platforms and Applications
Actionable Insight in Semiconductor Manufacturing, From Big Data to Cognitive Computing- Christophe Begue, IBM Watson
Larry Berardinis
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World of IoT: IoT Ready? Deploying Big Data, Analytics, IoT Platforms and Applications
Larry Berardinis, ASM International
Paul Berndt
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Test Vision 2020
Gary Bernstein
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Silicon Innovation Forum : Research and Industry
Quilt Packaging for Cost-Effective, High-Performance System-in-Package Design- Gary Bernstein, Notre Dame - NDNano
Kerry Bernstein
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IC Design Summit: Design for Security
Gazing into the Hardware Security Crystal Ball- Kerry Bernstein, DARPA
Sanjay Bhandari
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What’s Next in MEMS and Sensors: Innovation to Drive the Next Generation of Growth
Trends, Challenges & Opportunities for Miniaturized MEMS Sensors- Sanjay Bhandari, mCube
Mr. Suresh Biligiri
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Best of West Showcase
Rorze Shutter type N2 Purge Loadport- Suresh Biligiri, Rorze Automation
Mr. Guy Blalock
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Scaling: Node 10 to Node 5 - Dealing with the Slower Pace of Traditional Scaling
Dealing with the Slower Pace of Traditional Scaling- Guy Blalock, Micron Technology
David Bloss
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Intel Presentation and Panel Discussion: The Business Case for Supplier Diversity – Why it Matters to You
Daniel Bock
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Test Showcase
Production Test RF Calibration for Multi‐DUT Probe Cards: How to get the Most Accurate Measurements- Daniel Bock, Cascade Microtech
David Bolognia
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SiP Next 2 - IoT & Smart Things - SiP Integration
Smart Things Require Smart Packaging- David Bolognia, Analog Devices
Bill Bottoms Ph.D.
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Packaging Photonics for Speed & Bandwidth
Heterogeneous Integration and the Photonics Packaging Roadmap- Bill Bottoms, 3MTS
Chartering the Heterogeneous Integration Roadmap - William Chen, ASE Group & Bill Bottoms, Third Millennium Test Solutions
Christopher Bower
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Packaging Developments for Flexible Hybrid Electronics
Flexible Hybrid Electronics by Micro-Transfer-Printing- Christopher Bower, X-Celeprint
Kenneth Bradley
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Silicon Innovation Forum: Startups & New Ventures
PixelEXX Systems: Seeing Beyond the Boundries of the Human Eye- Kenneth Bradley, PixelEXX
Benjamin Brown
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Test Vision 2020
Gary Bultman
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Silicon Innovation Forum: Startups & New Ventures Panel Session
David Butler
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SiP Next 2 - IoT & Smart Things - SiP Integration
Assembly Equipment for Advanced Packaging- David Butler, SPTS & Bob Chylak, KNS
Michael Campbell
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Smart Manufacturing: Profiting from Big Data Analytics and (even more) Advanced Process Control for Higher Yield, Higher Mix in the Front and Back End
CONNECT Executive Summit
Big Data and Fabless Manufacturing- Michael Campbell, Qualcomm
Rich Chaney
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Next Generation Flexible Health Monitoring Devices
Flexible Hybrid Electronics: System Design & Reliability- Rich Chaney, American Semiconductor
Joseph Chang
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Flex Hybrid Electronics Processing and Packaging
A Process Development Kit (PDK) for a Fully-Additive Printed Electronics Process- Joseph Chang, Nanyang Technological University, Singapore
Tony Chao
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Silicon Innovation Forum: Startups & New Ventures Panel Session
Inigo Charola
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Best of West Showcase
Graphene: Wafer Scale Integration - Inigo Charola, Graphenea
Kevin Chasey
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≤200mm Semiconductor Manufacturing Is Here To Stay
≤200mm Semiconductor Manufacturing Is Here To Stay OEM Panel- Kevin Chasey, TEL US
Michael Chen
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IC Design Summit: Design for Security
Microelectronic Value Chain Security Platform Solution- Michael Chen, Mentor Graphics
William T. Chen Ph.D.
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SEMI/Gartner Market Symposium
William T. Chen Ph.D.
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SiP Next 1 – Processor - Memory/Analog Integration
SiP Next 1 – Processor - Memory/Analog Integration Session Introduction- William Chen, ASE Group
Chartering the Heterogeneous Integration Roadmap - William Chen, ASE Group & Bill Bottoms, Third Millennium Test Solutions
William T. Chen
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Innovations in SiP & Heterogeneous Integration - William T. Chen, ASE Group
Manoj Chinnakonda
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Flex Hybrid Electronics Processing and Packaging
Simulating Performance and Reliability of FHEs- Manoj Chinnakonda, Dassault Systems
David Christensen
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SEMI/Gartner Market Symposium
SEMI/Gartner Market Symposium- Welcome and Opening Remarks: David Christensen, Senior Research Analyst, Gartner
Jeff Christian
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3D Printing: A New Dimension in Manufacturing
Additive Manufacturing Impact on Engineering Cycle Time- Jeff Christian, Phoenix DeVentures
Cristina Chu
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Future U: Exploring Careers in the Microelectronics Industry
Mike Chudzik Ph.D.
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Scaling: Node 10 to Node 5 - Dealing with the Slower Pace of Traditional Scaling
Fins and Wires — How do we get to 5nm?- Mike Chudzik, Ph.D., Applied Materials
Mr. Bob Chylak
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SiP Next 2 - IoT & Smart Things - SiP Integration
Assembly Equipment for Advanced Packaging- David Butler, SPTS & Bob Chylak, KNS
Michael Ciesinski
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Flex Hybrid Electronics Processing and Packaging
Flex Hybrid Electronics Processing and Packaging- Welcome- Michael Ciesinski, FlexTech- a SEMI Strategic Partner
Tim Cleary
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Test Vision 2020
Michael Corbett
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Materials: Manufacturing Challenges and Realities at Advanced Nodes
Mike Corbett
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Materials: Manufacturing Challenges and Realities at Advanced Nodes- Session Introduction- Mike Corbett, Linx Consulting
John Cummings
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≤200mm Semiconductor Manufacturing Is Here To Stay
John Cummings, Applied Materials
Jerry Cutini
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Women in Technology Forum
Suman Datta Ph.D.
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Pathfinding Beyond 5nm
Tunnel FETs - the Next Switch in the Post FinFET Era?- Suman Datta
Christian G. Dieseldorff
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≤200mm Semiconductor Manufacturing Is Here To Stay
200mm Fab: Trends, Status, and Forecast- Christian Dieseldorff, SEMI
Christian Gregor Dieseldorff
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SEMI/Gartner Market Symposium
200mm Fabs Awaken: A Glimpse into the Past, Present and Resurgence of 200mm Fabs - Christian Gregor Dieseldorff, SEMI
Adrienne Downey
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3D Printing: A New Dimension in Manufacturing
3D Printing: Opportunities Abound- Adrienne Downey, Semico Research
Hugh Durdan
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IC Design Summit: Design for Security
The Role of Third Party IP in Building Secure Devices- Hugh Durdan, Cadence
David Dutton
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Scaling: Node 10 to Node 5 - Dealing with the Slower Pace of Traditional Scaling
Utilizing EDA Tools and Methodologies to Meet the Challenges of Designing to the 5nm FinFET- David Dutton, Silvaco
Dave Dwelley
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Analog and New Frontiers: Equipment Supplier Forecast, Challenges Specific to the Manufacture and Test of Analog Devices
Challenges of Battery Management Systems (BMS) in Electric and Hybrid Vehicles Battery Safety, Measurement Accuracy, System Reliability- Dave Dwelley, Linear Technology
Mr. Geir Eide
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Test Vision 2020
Mr. Jean-Christophe Eloy
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SiC, Sapphire, GaN, GaAs… : what is the business evolution of the non-Silicon based semiconductor industry?- JC Eloy, Yole Developpement
Tetsuo Endoh
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Silicon Innovation Forum : Research and Industry
Dr. Tetsuo Endoh, Tohoku University CEIS
Karen Erz
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≤200mm Semiconductor Manufacturing Is Here To Stay
TI's Success Story of Analog Devices on 300mm Wafers- Karen Erz, Texas Instruments
Cary Eskow
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IC Design Summit: Design for Security
Authentication Strategies: Establishing Trust that You Are Who You Say You Are- Cary Eskow, AVNET
Ben Eynon
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Smart Manufacturing: Profiting from Big Data Analytics and (even more) Advanced Process Control for Higher Yield, Higher Mix in the Front and Back End
Non-Standard Deviations: Challenges in Advanced Wafer Fab APC and Data Analytics- Ben Eynon, Samsung
Benjamin Eynon
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Future U: Exploring Careers in the Microelectronics Industry
Nicholas Fabino
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World of IoT: From Sensors to Automation—IoT Enbabled Smart Manufacturing
Nicholas Fabino, Invenios
Mukta Farooq
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Tutorial: 2.5D / 3D Integration Technology
Paul Farrar
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Power Electronics
The Status of the New York Power Electronics Consortium- Paul Farrar, Global 450mm Consortium (G450C), PEMC SUNY Polytechnic Institute - CNSE
Patrick Fay Ph.D.
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Tutorial: GaN Devices and Technology
Jim Feldhan
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Analog and New Frontiers: Equipment Supplier Forecast, Challenges Specific to the Manufacture and Test of Analog Devices
3D Printing: A New Dimension in Manufacturing
Analog Enabling New Frontiers- Jim Feldhan, Semico Research
Ira Feldman
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Test Showcase
Test Showcase Welcome- BiTS and SW Test Introductions: Ira Feldman, Feldman Engineering & Reynaldo Rincon, NXP
Alissa Fitzgerald Ph.D.
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What’s Next in MEMS and Sensors: Innovation to Drive the Next Generation of Growth
Emerging MEMS Technologies to Watch- Alissa Fitzgerald, AMFitzgerald
Derek Floyd
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Test Vision 2020
Session 1: New ATE Solutions for Upcoming Analog Test Needs- Derek Floyd, Advantest
John Foley
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Best of West Showcase
Wire Bonding Solutions for Complex Memory Packages- John Foley, Kulicke & Soffa Industries
Dale Ford
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Analog and New Frontiers: Market Drivers, the Applications and Design requirements, and the Supply Chain Challenges
Analog IC Dynamics and Directions- Dale Ford, IHS Technology
Paul Franzon
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Interconnect Solutions for Next Generation Computers
Interconnect-Driven Solutions Through Codesign- Paul Franzon, North Carolina State University
David Fried
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Best of West Showcase
Technology Development - The “In Between”- David Fried, Coventor
Simon Fried
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3D Printing: A New Dimension in Manufacturing
3D Printing: A New Dimension in Electronics Prototyping & Manufacturing- Simon Fried, Nano Dimension
Dr. Corey Fucetola
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Silicon Innovation Forum: Startups & New Ventures
Corey Fucetola, MIT
Peter Gammel
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Compound Semiconductors: Enabling Next Generation Computing and Communications
RF Architectures and Integration Roadmaps for 5G Smartphones- Peter Gammel, Skyworks Solutions
Dan Gamota
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Flex Hybrid Electronics Processing and Packaging
Future U: Exploring Careers in the Microelectronics Industry
Challenges and Opportunities as Electronics Architectures Migrate from Rigid PCBs, to Flexible PCBs, to Thin Flexible Hybrid Electronics- Dan Gamota, Jabil
Brian Gilmore
Event Details
World of IoT: IoT Ready? Deploying Big Data, Analytics, IoT Platforms and Applications
Operational Intelligence on the Factory Floor: Using Big Data and Analytics to Transform Manufacturing- Brian Gilmore, Splunk
Daniel Gitlin
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Pathfinding Beyond 5nm
CoolCubeTM Technology: A Cost Effective Solution for Monolithic 3D Integration- Daniel Gitlin, CEA-Leti
Tony Neal Graves
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Smart Manufacturing: The Key Opportunities and Challenges of the Next Generation of Manufacturing for the Electronics Value Chain
IC Manufacturing Intelligence Unleashed Through IoT- Tony Neal Graves, Intel
Craig Green
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Silicon Innovation Forum: Startups & New Ventures
A Versatile, Easy to Apply Product for Heat Dissipation: The Second Coming of Carbon Nanotubes- Craig Green, Carbice Nanotechnologies
Emerald Greig
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≤200mm Semiconductor Manufacturing Is Here To Stay
The Indispensable Secondary Equipment Market Trend in the Era of Mobility and IoT!- Emerald Greig, SurplusGLOBAL
≤200mm Semiconductor Manufacturing Is Here To Stay OEM Panel- Moderator, Emerald Greig, SurplusGLOBAL
David Grierson
Event Details
Silicon Innovation Forum: Startups & New Ventures
Direct Transfer Printing Tools for Flexible Hybrid Electronics Assembly- David Grierson, systeMECH LLC
Steve Groothuis
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Sensing the Future: Enabling Applications for a Smarter World
MEMS and Sensors Packaging – Leveraging More Than Moore Concepts- Steve Groothuis, Samtec
Anders Grunnet-Jepsen
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SiP Next 2 - IoT & Smart Things - SiP Integration
When Robots See…- Anders Grunnet-Jepsen, Intel
Melissa Grupen-Shemansky
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Flex Hybrid Electronics Processing and Packaging
Next Generation Flexible Health Monitoring Devices
Flex Hybrid Electronics Processing and Packaging- Introduction & Overview- Melissa Grupen-Shemansky, SEMI
Next Generation Flexible Health Monitoring Devices- Welcome- Melissa Grupen-Shemansky, SEMI
Pierric Gueguen
Event Details
What’s Next in MEMS and Sensors: Innovation to Drive the Next Generation of Growth
≤200mm Semiconductor Manufacturing Is Here To Stay
Flex Hybrid Electronics Processing and Packaging
Gas Sensors, Detection of Particles, 3D Images…: What are the Next Opportunities in MEMS?- Pierric Gueguen , Yole Developpement
Today's Flexible Electronic Market and What Can We Expect for the Next Five Years?- Pierric Gueguen, Yole Developpement
Bhavna Guidry
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Session 3: What can a Built in CPU do for the Mixed Signal Test Engineer?- Bhavna Guidry, Texas Instruments
Bhavna Guidry
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Test Vision 2020
Ravi Gukathasan
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Silicon Innovation Forum: Startups & New Ventures
HVM of UHP Organometallics- Ravi Gukathasan, Digital Specialty Chemicals
Oliver Gunasekara
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Silicon Innovation Forum: Startups & New Ventures
Oliver Gunasekara, NGCodec
Debbie Gustafson
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Women in Technology Forum
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