SEMICON West 2016

Michael Campbell
Senior VP Engineering
Qualcomm


Michael Campbell is Senior Vice President of Engineering for QUALCOMM CDMA Technologies, responsible for QCT Product and Test Engineering. He is currently driving test strategy, test automation, DFT, yield engineering, foundry bring up, and Failure Analysis. Mike joined QCT in 1996 has led a diverse set of responsibility at Qualcomm from Foundry bring up, to design automation and product development. The Qualcomm test and design environment is a worldwide set of virtual teams focused on delivering quality product to customers. Qualcomm currently uses all major foundries and drives cross foundry 2nd source product matching to enable a diverse supply chain and minimize geo risk in the product delivery. Prior to joining QUALCOMM, Mike was an engineer and manager at several semiconductor companies, including Mostek, INMOS and Honeywell. He holds a BSEE & CE from Clarkson University.

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