SEMICON West 2016

David Bolognia
Senior Package Development Manager, System in Package
Analog Devices


David Bolognia joined Analog Devices in 2011 and has led the development of System in Package as a mainstream packaging technology at ADI. He has built a team of engineers and designers, which provide the design, prototyping, qualification and product support to product lines around the world who are moving toward customer solutions that include a higher level of integration than historic discrete and MCM packages. Product applications include RF, medical imaging, vital signs/wearables, and general industrial, military, and communications. Expertise includes layout and electrical, thermal and mechanical simulation of products on rigid and flex substrates. Previously, David led the System in Package business unit at Amkor Technology where he had responsibility for the technology roadmap and profit & loss sheet. He also has experience in OEM product design and development for consumer and computing products at Compaq Computer. David has over 25 issued patents with the USPTO and numerous others filed.

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