SEMICON West 2016

JULIE ADAMS
Director
UBOTIC


Julie Adams holds a BS degree in Mechanical Engineering from the University of Arizona and has authored numerous technical papers throughout her career. She has over 26 years of strong global team management & technical sales, engineering, along with process and product development experience in advanced packaging technologies. She began her career at Motorola, Semiconductor Products division, where she led the technical effort to commercialize the first ASIC plastic ball grid array package. Later joined Amkor Electronics, and played a key role in the development and selling of their first PBGA package family. In 1997, as a Regional Manager for Flip Chip Technologies, she promoted their wafer bumping technology to U.S and Asian semiconductor companies, which led to the adoption of wafer bumping and wafer level packaging. In addition, she has extensive experience driving International equipment sales for the semiconductor industry, where she was Worldwide Director of Worldwide Sales & Service for RVSI Vanguard and later Royce Instruments. Currently, she manages U.S. Sales and Marketing for UBOTIC Company Limited with their specialized MEMS and Sensor packaging.

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