SEMICON West 2016
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Philippe Absil Ph.D.
Event Details
Compound Semiconductors: Enabling Next Generation Computing and Communications
Next Generation Silicon Photonics for Computing and Communication- Philippe Absil, imec
Stacy Ajouri
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Test Vision 2020
Arnold Alderman
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Packaging Power - Enabling a Variety of Applications and Efficiency
Unmet Challenges of Embedded Components for 3D Power Electronics Packaging- Arnold Alderman, Anagenesis
Michael Alfano
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Test Vision 2020
Azar Alizadeh
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Next Generation Flexible Health Monitoring Devices
Manufacturing of Wearable Sensors for Human Health and Performance Monitoring- Azar Alizadeh, GE Global Research
Tim Archer
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CONNECT Executive Summit
Dave Armstrong
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Test Vision 2020
Session 2: Thermal Testing of Singulated Devices Gets Us Closer to Known-Good Die/Stack - Dave Armstrong, Advantest
Ahmad Bahai Ph.D.
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Analog and New Frontiers: Market Drivers, the Applications and Design requirements, and the Supply Chain Challenges
Innovation in Power Semiconductor- Ahmad Bahai, Texas Instruments
Krishnamoorthy Balachandran
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Test Vision 2020
Aditi Banerjee Ph.D.
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Women in Technology Forum
Srinivasa Banna
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Materials: Manufacturing Challenges and Realities at Advanced Nodes
Challenges & Realities of Advanced Node Manufacturing- Srinivasa Banna, GLOBALFOUNDRIES
Ivor Barber
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SiP Next 2 - IoT & Smart Things - SiP Integration
Opportunities for Integration in IoT- Ivor Barber, Xilinx
Denis Barbini Ph.D.
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Packaging Developments for Flexible Hybrid Electronics
Developing the Next Generation Catheter- Denis Barbini, Universal Instruments
Richard Barnett
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Best of West Showcase
SPTS’ Rapier-300S for Plasma Dicing After Grind for 300mm Wafers- Richard Barnett, SPTS Technologies
Francois Beauchaud
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World of IoT: From Sensors to Automation—IoT Enbabled Smart Manufacturing
Smart Sensing for IoT- Francois Beauchaud, Bosch Sensortec
Christophe Begue
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World of IoT: IoT Ready? Deploying Big Data, Analytics, IoT Platforms and Applications
Actionable Insight in Semiconductor Manufacturing, From Big Data to Cognitive Computing- Christophe Begue, IBM Watson
Larry Berardinis
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World of IoT: IoT Ready? Deploying Big Data, Analytics, IoT Platforms and Applications
Larry Berardinis, ASM International
Paul Berndt
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Test Vision 2020
Gary Bernstein
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Silicon Innovation Forum : Research and Industry
Quilt Packaging for Cost-Effective, High-Performance System-in-Package Design- Gary Bernstein, Notre Dame - NDNano
Kerry Bernstein
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IC Design Summit: Design for Security
Gazing into the Hardware Security Crystal Ball- Kerry Bernstein, DARPA
Sanjay Bhandari
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What’s Next in MEMS and Sensors: Innovation to Drive the Next Generation of Growth
Trends, Challenges & Opportunities for Miniaturized MEMS Sensors- Sanjay Bhandari, mCube
Mr. Suresh Biligiri
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Best of West Showcase
Rorze Shutter type N2 Purge Loadport- Suresh Biligiri, Rorze Automation
Mr. Guy Blalock
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Scaling: Node 10 to Node 5 - Dealing with the Slower Pace of Traditional Scaling
Dealing with the Slower Pace of Traditional Scaling- Guy Blalock, Micron Technology
David Bloss
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Intel Presentation and Panel Discussion: The Business Case for Supplier Diversity – Why it Matters to You
Daniel Bock
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Test Showcase
Production Test RF Calibration for Multi‐DUT Probe Cards: How to get the Most Accurate Measurements- Daniel Bock, Cascade Microtech
David Bolognia
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SiP Next 2 - IoT & Smart Things - SiP Integration
Smart Things Require Smart Packaging- David Bolognia, Analog Devices
Bill Bottoms Ph.D.
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Packaging Photonics for Speed & Bandwidth
Heterogeneous Integration and the Photonics Packaging Roadmap- Bill Bottoms, 3MTS
Chartering the Heterogeneous Integration Roadmap - William Chen, ASE Group & Bill Bottoms, Third Millennium Test Solutions
Christopher Bower
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Packaging Developments for Flexible Hybrid Electronics
Flexible Hybrid Electronics by Micro-Transfer-Printing- Christopher Bower, X-Celeprint
Benjamin Brown
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Test Vision 2020
Gary Bultman
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Silicon Innovation Forum: Startups & New Ventures Panel Session
David Butler
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SiP Next 2 - IoT & Smart Things - SiP Integration
Assembly Equipment for Advanced Packaging- David Butler, SPTS & Bob Chylak, KNS
Michael Campbell
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Smart Manufacturing: Profiting from Big Data Analytics and (even more) Advanced Process Control for Higher Yield, Higher Mix in the Front and Back End
CONNECT Executive Summit
Big Data and Fabless Manufacturing- Michael Campbell, Qualcomm
Rich Chaney
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Next Generation Flexible Health Monitoring Devices
Flexible Hybrid Electronics: System Design & Reliability- Rich Chaney, American Semiconductor
Joseph Chang
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Flex Hybrid Electronics Processing and Packaging
A Process Development Kit (PDK) for a Fully-Additive Printed Electronics Process- Joseph Chang, Nanyang Technological University, Singapore
Tony Chao
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Silicon Innovation Forum: Startups & New Ventures Panel Session
Kevin Chasey
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≤200mm Semiconductor Manufacturing Is Here To Stay
≤200mm Semiconductor Manufacturing Is Here To Stay OEM Panel- Kevin Chasey, TEL US
Michael Chen
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IC Design Summit: Design for Security
Microelectronic Value Chain Security Platform Solution- Michael Chen, Mentor Graphics
William T. Chen Ph.D.
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SEMI/Gartner Market Symposium
William T. Chen Ph.D.
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SiP Next 1 – Processor - Memory/Analog Integration
SiP Next 1 – Processor - Memory/Analog Integration Session Introduction- William Chen, ASE Group
Chartering the Heterogeneous Integration Roadmap - William Chen, ASE Group & Bill Bottoms, Third Millennium Test Solutions
William T. Chen
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Innovations in SiP & Heterogeneous Integration - William T. Chen, ASE Group
Manoj Chinnakonda
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Flex Hybrid Electronics Processing and Packaging
Simulating Performance and Reliability of FHEs- Manoj Chinnakonda, Dassault Systems
David Christensen
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SEMI/Gartner Market Symposium
SEMI/Gartner Market Symposium- Welcome and Opening Remarks: David Christensen, Senior Research Analyst, Gartner
Jeff Christian
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3D Printing: A New Dimension in Manufacturing
Additive Manufacturing Impact on Engineering Cycle Time- Jeff Christian, Phoenix DeVentures
Cristina Chu
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Future U: Exploring Careers in the Microelectronics Industry
Mike Chudzik Ph.D.
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Scaling: Node 10 to Node 5 - Dealing with the Slower Pace of Traditional Scaling
Fins and Wires — How do we get to 5nm?- Mike Chudzik, Ph.D., Applied Materials
Mr. Bob Chylak
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SiP Next 2 - IoT & Smart Things - SiP Integration
Assembly Equipment for Advanced Packaging- David Butler, SPTS & Bob Chylak, KNS
Tim Cleary
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Test Vision 2020
Michael Corbett
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Materials: Manufacturing Challenges and Realities at Advanced Nodes
Mike Corbett
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Materials: Manufacturing Challenges and Realities at Advanced Nodes- Session Introduction- Mike Corbett, Linx Consulting
John Cummings
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≤200mm Semiconductor Manufacturing Is Here To Stay
John Cummings, Applied Materials
Jerry Cutini
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Women in Technology Forum
Suman Datta Ph.D.
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Pathfinding Beyond 5nm
Tunnel FETs - the Next Switch in the Post FinFET Era?- Suman Datta
Christian G. Dieseldorff
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≤200mm Semiconductor Manufacturing Is Here To Stay
200mm Fab: Trends, Status, and Forecast- Christian Dieseldorff, SEMI
Christian Gregor Dieseldorff
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SEMI/Gartner Market Symposium
200mm Fabs Awaken: A Glimpse into the Past, Present and Resurgence of 200mm Fabs - Christian Gregor Dieseldorff, SEMI
Adrienne Downey
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3D Printing: A New Dimension in Manufacturing
3D Printing: Opportunities Abound- Adrienne Downey, Semico Research
Hugh Durdan
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IC Design Summit: Design for Security
The Role of Third Party IP in Building Secure Devices- Hugh Durdan, Cadence
David Dutton
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Scaling: Node 10 to Node 5 - Dealing with the Slower Pace of Traditional Scaling
Utilizing EDA Tools and Methodologies to Meet the Challenges of Designing to the 5nm FinFET- David Dutton, Silvaco
Dave Dwelley
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Analog and New Frontiers: Equipment Supplier Forecast, Challenges Specific to the Manufacture and Test of Analog Devices
Challenges of Battery Management Systems (BMS) in Electric and Hybrid Vehicles Battery Safety, Measurement Accuracy, System Reliability- Dave Dwelley, Linear Technology
Mr. Geir Eide
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Test Vision 2020
Mr. Jean-Christophe Eloy
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SiC, Sapphire, GaN, GaAs… : what is the business evolution of the non-Silicon based semiconductor industry?- JC Eloy, Yole Developpement
Tetsuo Endoh
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Silicon Innovation Forum : Research and Industry
Dr. Tetsuo Endoh, Tohoku University CEIS
Karen Erz
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≤200mm Semiconductor Manufacturing Is Here To Stay
TI's Success Story of Analog Devices on 300mm Wafers- Karen Erz, Texas Instruments
Cary Eskow
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IC Design Summit: Design for Security
Authentication Strategies: Establishing Trust that You Are Who You Say You Are- Cary Eskow, AVNET
Ben Eynon
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Smart Manufacturing: Profiting from Big Data Analytics and (even more) Advanced Process Control for Higher Yield, Higher Mix in the Front and Back End
Non-Standard Deviations: Challenges in Advanced Wafer Fab APC and Data Analytics- Ben Eynon, Samsung
Benjamin Eynon
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Future U: Exploring Careers in the Microelectronics Industry
Nicholas Fabino
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World of IoT: From Sensors to Automation—IoT Enbabled Smart Manufacturing
Nicholas Fabino, Invenios
Mukta Farooq
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Tutorial: 2.5D / 3D Integration Technology
Paul Farrar
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Power Electronics
The Status of the New York Power Electronics Consortium- Paul Farrar, Global 450mm Consortium (G450C), PEMC SUNY Polytechnic Institute - CNSE
Patrick Fay Ph.D.
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Tutorial: GaN Devices and Technology
Jim Feldhan
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Analog and New Frontiers: Equipment Supplier Forecast, Challenges Specific to the Manufacture and Test of Analog Devices
3D Printing: A New Dimension in Manufacturing
Analog Enabling New Frontiers- Jim Feldhan, Semico Research
Ira Feldman
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Test Showcase
Test Showcase Welcome- BiTS and SW Test Introductions: Ira Feldman, Feldman Engineering & Reynaldo Rincon, NXP
Alissa Fitzgerald Ph.D.
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What’s Next in MEMS and Sensors: Innovation to Drive the Next Generation of Growth
Emerging MEMS Technologies to Watch- Alissa Fitzgerald, AMFitzgerald
Derek Floyd
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Test Vision 2020
Session 1: New ATE Solutions for Upcoming Analog Test Needs- Derek Floyd, Advantest
John Foley
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Best of West Showcase
Wire Bonding Solutions for Complex Memory Packages- John Foley, Kulicke & Soffa Industries
Dale Ford
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Analog and New Frontiers: Market Drivers, the Applications and Design requirements, and the Supply Chain Challenges
Analog IC Dynamics and Directions- Dale Ford, IHS Technology
Paul Franzon
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Interconnect Solutions for Next Generation Computers
Interconnect-Driven Solutions Through Codesign- Paul Franzon, North Carolina State University
David Fried
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Best of West Showcase
Technology Development - The “In Between”- David Fried, Coventor
Simon Fried
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3D Printing: A New Dimension in Manufacturing
3D Printing: A New Dimension in Electronics Prototyping & Manufacturing- Simon Fried, Nano Dimension
Peter Gammel
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Compound Semiconductors: Enabling Next Generation Computing and Communications
RF Architectures and Integration Roadmaps for 5G Smartphones- Peter Gammel, Skyworks Solutions
Dan Gamota
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Flex Hybrid Electronics Processing and Packaging
Future U: Exploring Careers in the Microelectronics Industry
Challenges and Opportunities as Electronics Architectures Migrate from Rigid PCBs, to Flexible PCBs, to Thin Flexible Hybrid Electronics- Dan Gamota, Jabil
Brian Gilmore
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World of IoT: IoT Ready? Deploying Big Data, Analytics, IoT Platforms and Applications
Operational Intelligence on the Factory Floor: Using Big Data and Analytics to Transform Manufacturing- Brian Gilmore, Splunk
Daniel Gitlin
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Pathfinding Beyond 5nm
CoolCubeTM Technology: A Cost Effective Solution for Monolithic 3D Integration- Daniel Gitlin, CEA-Leti
Tony Neal Graves
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Smart Manufacturing: The Key Opportunities and Challenges of the Next Generation of Manufacturing for the Electronics Value Chain
IC Manufacturing Intelligence Unleashed Through IoT- Tony Neal Graves, Intel
Emerald Greig
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≤200mm Semiconductor Manufacturing Is Here To Stay
The Indispensable Secondary Equipment Market Trend in the Era of Mobility and IoT!- Emerald Greig, SurplusGLOBAL
≤200mm Semiconductor Manufacturing Is Here To Stay OEM Panel- Moderator, Emerald Greig, SurplusGLOBAL
David Grierson
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Silicon Innovation Forum: Startups & New Ventures
Direct Transfer Printing Tools for Flexible Hybrid Electronics Assembly- David Grierson, systeMECH LLC
Steve Groothuis
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Sensing the Future: Enabling Applications for a Smarter World
MEMS and Sensors Packaging – Leveraging More Than Moore Concepts- Steve Groothuis, Samtec
Anders Grunnet-Jepsen
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SiP Next 2 - IoT & Smart Things - SiP Integration
When Robots See…- Anders Grunnet-Jepsen, Intel
Melissa Grupen-Shemansky
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Flex Hybrid Electronics Processing and Packaging
Next Generation Flexible Health Monitoring Devices
Flex Hybrid Electronics Processing and Packaging- Introduction & Overview- Melissa Grupen-Shemansky, SEMI
Next Generation Flexible Health Monitoring Devices- Welcome- Melissa Grupen-Shemansky, SEMI
Pierric Gueguen
Event Details
What’s Next in MEMS and Sensors: Innovation to Drive the Next Generation of Growth
≤200mm Semiconductor Manufacturing Is Here To Stay
Flex Hybrid Electronics Processing and Packaging
Gas Sensors, Detection of Particles, 3D Images…: What are the Next Opportunities in MEMS?- Pierric Gueguen , Yole Developpement
Today's Flexible Electronic Market and What Can We Expect for the Next Five Years?- Pierric Gueguen, Yole Developpement
Bhavna Guidry
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Session 3: What can a Built in CPU do for the Mixed Signal Test Engineer?- Bhavna Guidry, Texas Instruments
Bhavna Guidry
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Test Vision 2020
Debbie Gustafson
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Women in Technology Forum
Brian Haas
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Smart Manufacturing: The Key Opportunities and Challenges of the Next Generation of Manufacturing for the Electronics Value Chain
Robert Halliday
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Bulls and Bears
Bulls and Bears- Welcome & Opening Remarks- Moderator, Robert Halliday, Applied Materials
Bulls and Bears- Closing Remarks- Robert Halliday, Applied Materials
Shu-Jen Han Ph.D.
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Pathfinding Beyond 5nm
Progress and Challenges in Carbon Nanotube Logic Technology- Shu-Jen Han, IBM
Tonnie Hansen
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Women in Technology Forum
Don Harroll
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Smart Manufacturing: Profiting from Big Data Analytics and (even more) Advanced Process Control for Higher Yield, Higher Mix in the Front and Back End
Remote Access Best Practice And How To Leverage It As A Spring Board For Security Management- Don Harroll, NextNine
Peter Hartwell
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Analog and New Frontiers: Market Drivers, the Applications and Design requirements, and the Supply Chain Challenges
Sensor Supply Chain Opportunities- Peter Hartwell, InvenSense
Kirk Hasserjian
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Smart Manufacturing: The Key Opportunities and Challenges of the Next Generation of Manufacturing for the Electronics Value Chain
SMART Service in SMART Factory- Kirk Hasserjian, Applied Materials
Kevin Heidrich
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Scaling: Node 10 to Node 5 - Dealing with the Slower Pace of Traditional Scaling
Finding Nanometers: Extending Process Control Capability to Extend Scaling to 5nm- Kevin Heidrich, Nanometrics
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