SEMICON Korea 2018

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Products (3)

BONDJET BJ955/959 HEAVY WIRE BONDER HUGE BOND AREA

Power modules, IGBT, EV battery applications; Increased productivity; Enlarged work platform; Speedy and precise; Low maintenance needs; Copper wir... More...

BONDJET BJ931 DUAL-HEAD LEADFRAME APPLICATIONS

Heavy-wire power leadframe package assembly; Specialized leadframe indexing system for power leadframes,eg. TO220, D-Pak and DFN in high productivi... More...

BONDJET BJ820 FULLY AUTOMATIC THIN WIRE BONDER

Best-seller; Valuable alternative to ball-bonding; 1μm repeatability; 40μm ultra-fine bond pad pitch; Optimized in large-scale production... More...