Hesse GmbH, founded in 1978, is a German equipment manufacturer delivering high-end semiconductor assembly equipment. Our products include automatic thin- and heavy-wire wedge bonders and ultrasonic flipchip bonders.
Thin Wire Bonders
Bondjet BJ820, designed for challenging applications like 40um ultra-fine pitch with real-time quality control, is featured with a huge bond area and a wear-free bondhead. It delivers rapid bonding speed up to 6 wires/second for optimal process flexibility and productivity.
Heavy Wire Bonders
Bondjet BJ955/959 single-head and BJ931 dual-head are capable of bonding 100-500um Al and Cu wires/power ribbons for applications like power modules, IGBT, automotive devices, CPV panels and RF amplifiers, etc. These machines are equipped with bondhead integrated pull testers, active wire cutter, E-Box (bondhead set-up visual aid), anti-vibration system, and the powerful patented PiQC real-time quality control system as well.
More to come
Other products' information, more detailed explanations and demonstrations are available on-site with our professional service engineers standing by to help. Welcome to visit us at #DS10!
Product Categories
200 Equipment, Assembly
- Device Handling; Feeding Systems
- Die Bonding; Attach Equipment
- Die Sorter; Pick & Place; Flip Chip Placement Systems
- Dispensing Systems
- Package Handling; Conveying Equipment
- Wire Bonding Equipment
202 Equipment, General Use
- Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
- Welding Equipment
500 Factory Monitoring & Control Systems (FMCS)
- Data Collection; Building control systems
502 Material Handling Systems
- Conveying; Material Handling Systems
- Robotics; Transfer Systems