2018FLEX

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Sessions (8)

Wearable Patch for Continuous Monitoring of Sweat Electrolytes (Room Big Sur)

14 Feb 18
8:00 AM - 8:25 AM

Tracks: 2018FLEX Full Conference, MedTech, Our Funded R&D Projects, Products, Sensors & Sensor Networks

Speaker(s): Azar Alizadeh
Session 5: Health Monitors Wearable Patch for Continuous Monitoring of Sweat Electrolytes Wednesday, February 14, 2018 8:00 AM - 8:25 AM Ma... More...

Session 13: Emerging Capabilities (Room Spyglass)

15 Feb 18
8:00 AM - 9:45 AM
Session 13: Emerging Capabilities A Holistic Approach to Thermal Management in Flexible/Hybrid Electronics Using Carbon Fiber Technology Thursd... More...

Investigation of Ultrathin/High IO Die Attach to Flexible Substrates (Room Cypress)

15 Feb 18
10:15 AM - 10:40 AM

Tracks: 2018FLEX Full Conference, IC/Hybrid Integration, Integration

Speaker(s): Michael Santos
Session 18: FHE Chip Integration Investigation of Ultrathin/High IO Die Attach to Flexible Substrates Thursday, February 15, 2018 10:15 A... More...

Flexible Oral Biosensing Platform (Room Big Sur)

14 Feb 18
8:25 AM - 8:45 AM

Tracks: 2018FLEX Full Conference, IC/Hybrid Integration, Integration, Manufacturing on Flex, MedTech, Our Funded R&D Projects, Printed Electronics, Products, Sensors & Sensor Networks

Speaker(s): David Schwartz
Session 5: Health Monitors Flexible Oral Biosensing Platform Wednesday, February 14, 2018 8:25 AM - 8:45 AM PARC and UCSD are developi... More...

Session 16: Sensors & Power (Room Spyglass)

15 Feb 18
10:15 AM - 12:00 PM
Session 16: Sensors & Power System Design for Flexible All-Organic Reflectance Oximeter Thursday, February 15, 2018 10:15 AM - 10:40 ... More...

Photonic Soldering to Enhance Manufacturability of Wearable Technology (Room Cypress)

15 Feb 18
11:00 AM - 11:20 AM

Tracks: 2018FLEX Full Conference, Manufacturing on Flex

Speaker(s): Vahid Akhavan
Session 18: FHE Chip Integration Photonic Soldering to Enhance Manufacturability of Wearable Technology Thursday, February 15, 2018 11:00 ... More...

Complex Flexible Hybrid Electronic Labels (Room Big Sur)

14 Feb 18
1:30 PM - 1:55 PM

Tracks: 2018FLEX Full Conference, Our Funded R&D Projects, Products

Speaker(s): Douglas Hackler
Session 9: Flexible Electronics Applications I Complex Flexible Hybrid Electronic Labels Wednesday, February 14, 2018 1:30 PM - 1:55 PM The... More...

Session 17: Substrates (Room Big Sur)

15 Feb 18
10:15 AM - 12:00 PM
Session 17: Substrates Flexible Glass Applications & Process Scaling Thursday, February 15, 2018 10:15 AM - 10:40 AM Refinement of... More...

Low Temperature flip chip bonding technology applicable to flexible hybrid electronics in the IoT era (Room Cypress)

15 Feb 18
11:20 AM - 11:40 AM

Tracks: 2018FLEX Full Conference, IC/Hybrid Integration, Integration

Speaker(s): Hiroshi Komatsu
Session 18: FHE Chip Integration Low Temperature flip chip bonding technology applicable to flexible hybrid electronics in the IoT era Thursday... More...

A Holistic Approach Towards Flexible Hybrid Integration for Large-Area Sensor Platforms by System Design and Demonstrations (Room Spyglass)

15 Feb 18
8:45 AM - 9:05 AM

Tracks: 2018FLEX Full Conference, Emerging Technologies, IC/Hybrid Integration, Our Funded R&D Projects

Speaker(s): James Sturm
Session 13: Emerging Capabilities A Holistic Approach Towards Flexible Hybrid Integration for Large-Area Sensor Platforms by System Design and D... More...

Session 18: FHE Chip Integration (Room Cypress)

15 Feb 18
10:15 AM - 12:00 PM
Session 18: FHE Chip Integration Investigation of Ultrathin/High IO Die Attach to Flexible Substrates Thursday, February 15, 2018 10:15 A... More...

Joining to Temperature Sensitive Substrates with Asymmetric Heating (Room Cypress)

15 Feb 18
11:40 AM - 12:00 PM

Tracks: 2018FLEX Full Conference, Manufacturing on Flex

Speaker(s): Peter McClure
Session 18: FHE Chip Integration Joining to Temperature Sensitive Substrates with Asymmetric Heating Thursday, February 15, 2018 11:40 AM... More...

Flexible (1mm bending radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6µm) and Reliable Flexible Cu-based Interconnects (Room Cypress)

15 Feb 18
10:40 AM - 11:00 AM

Tracks: 2018FLEX Full Conference, IC/Hybrid Integration, Integration, Our Funded R&D Projects

Speaker(s): Amir Hanna
Session 18: FHE Chip Integration Flexible (1mm bending radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported... More...

Ultra-Thin, solid-state recharageable battery with vertically integrated solar cell (Room Spyglass)

15 Feb 18
11:00 AM - 11:20 AM

Tracks: 2018FLEX Full Conference, Our Funded R&D Projects, Products

Speaker(s): Brian Berland
Session 16: Sensors & Power Ultra-Thin, solid-state recharageable battery with vertically integrated solar cell Thursday, February 15, 2018... More...

Multi-Material Ribbon Ceramic Supply Chain to Product Application Roadmap for FHE (Room Big Sur)

15 Feb 18
11:20 AM - 11:40 AM

Tracks: 2018FLEX Full Conference, Materials, Our Funded R&D Projects

Speaker(s): John Olenick
Session 17: Substrates Multi-Material Ribbon Ceramic Supply Chain to Product Application Roadmap for FHE Thursday, February 15, 2018 11:20&nbs... More...

Ultra-light-weight, thin-film CdTe PV minimodules on flexible ceramic (Room Spyglass)

15 Feb 18
11:20 AM - 11:40 AM

Tracks: 2018FLEX Full Conference, Materials, Our Funded R&D Projects, Products

Speaker(s): Victor Plotnikov
Session 16: Sensors & Power Ultra-light-weight, thin-film CdTe PV minimodules on flexible ceramic Thursday, February 15, 2018 11:20 A... More...