Session 18: FHE Chip Integration

Investigation of Ultrathin/High IO Die Attach to Flexible Substrates
Thursday, February 15, 2018
10:15 AM - 10:40 AM

Flexible (1mm bending radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6µm) and Reliable Flexible Cu-based Interconnects
Thursday, February 15, 2018
10:40 AM - 11:00 AM

Photonic Soldering to Enhance Manufacturability of Wearable Technology
Thursday, February 15, 2018
11:00 AM - 11:20 AM

Low Temperature flip chip bonding technology applicable to flexible hybrid electronics in the IoT era
Thursday, February 15, 2018
11:20 AM - 11:40 AM

Joining to Temperature Sensitive Substrates with Asymmetric Heating
Thursday, February 15, 2018
11:40 AM - 12:00 PM