Continuous shrinkage of device dimension to nm level requires new materials and novel device structure which demand a new paradigm in contamination control and planarization to improve the production yield and device reliability. CFM technology has become more critical in device manufacturing below 20 nm devices. Film loss-free and damage free cleaning technology face severe challenges for next-generation device fabrication. Also, CMP has grown to be one of the essential technologies for advanced node device fabrications such as FinFET, III/V materials and V-NAND. 7-nm logic technology is already under developing now, and CMP will play the leading role on patterning for sub-7 nm FEOL and MOL process steps. To overcome the new CMP challenges, the consumables should play a more critical role. The purpose of this session is to increase the level of understanding on current and future CFM/CMP technology.
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