SEMICON Korea 2018

Heesook Cheon
Engineer
Samsung Electronics


Heesook Cheon has been an engineer at Samsung Electronics for 4 years with responsibility of CMP (chemical mechanical polishing) process development. Ms. Cheon developed CMP process technology for 20 nm and 1X nm DRAM especially, a variety of polymer / metal / poly-silicon CMP technologies, including DRAM process integration. Ms. Cheon received the bachelors’ degree in Chemical and Biomolecular Engineering from the Sogang University, Seoul, South Korea.

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