SEMICON Korea 2018

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Products (6)

Elevate® Cu 6340

Low stress copper bath that can be used for RDL and general purpose semiconductor plating. Plates at 1 – 2 microns/minute with virtually no inter... More...

TechniStrip® NF52

Advanced formula that is designed to offer full dissolution with excellent metal compatibility and high loading capacity. Solvent based stripper More...

TechniStrip® P1331

An advanced photoresist stripper that has a wide range of applications from DUV to thick negative resins and passivation layerreworking. Ideal for ... More...

TechniEtch TBR19

Fluoride free, aqueous etchant designed to selectively remove titanium or titanium alloy (TiN, TiW) barrier layers. More...

Real Time Analyzer - 3D

This system utilizes all the technology found in the well-established RTA system with additional features to increase reliability and robustness. More...

Elevate® Gold 7990

Electrolytic non-cyanide gold process that produces pure, soft gold deposits. More...