2018FLEX
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Celebrating Pi Day
TSI
(
Booth
1008
)
National Pi day at TSI
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Processing on Quatz Wafer
TSI
(
Booth
1008
)
Processing on Quatz Wafer
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Custom Sensors
Interlink Electronics, Inc.
(
Booth
2005
)
The largest part of Interlink’s business today is the development and manufacture of custom solutions for some of our major customers. We offer ful...
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Force Sensing Resistor® (FSR®) – 400 Series
Interlink Electronics, Inc.
(
Booth
2005
)
Interlink's FSR's provide durable, reliable, easy to measure, thin form factor and low cost solution for human machine interface (HMI) touch soluti...
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NEW – VersaPad® 2.0
Interlink Electronics, Inc.
(
Booth
2005
)
The Versapad® 2.0 touchpad is Interlink's new larger size mousing solution at 115 x 65 mm. Designed for OEM and rugged applications. The module's ...
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SE-2100 sheet to sheet spectroscopic ellipsometer
Semilab
(
Booth
4008
)
Semilab SE-2100 platform offers Optical & Electrical Metrology for Thin Film Coating characterization on flexible substrates (Sheet to Sheet). The ...
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R2R Spectroscopic Ellipsometer
Semilab
(
Booth
4008
)
Semilab R2R SE platform offers multi-layer thickness and refractive index determination in real time, on a moving roll-to-roll foil. The platform a...
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E-Film
Delphon Industries
(
Booth
2007
)
Delphon E-Film
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MEMS Packaging
Unisem
(
Booth
5007
)
Unisem has developed packaging solutions for many MEMs applications including microphones for the mobile market, pressure sensors for automotive an...
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Technology Hub Equipment and Process Capabilities
NextFlex
(
Booth
1001
)
The NextFlex Technology Hub consists of 15,000 SF of class 10,000 cleanroom, lab, and support space, with printing and bare die integration process...
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Project Calls (RFPs)
NextFlex
(
Booth
1001
)
Via a series of Project Calls that provide cash awards to proposal teams for development projects that are critical to Flexible Hybrid Electronics ...
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Flexible Arduino
NextFlex
(
Booth
1001
)
The Arduino is an open-source microcontroller based on easy-to-use hardware and software. It is intended for anyone making interactive projects. Cu...
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XE181x
Namics Technologies, Inc.
(
Booth
1007
)
XE181x is a silver filled conductive ink for stretchable, eTextile applications.
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SIFT-MS Real-Time Gas Analysis
Quantum Analytics
(
Booth
5000
)
Measure diverse volatile organic compounds (VOCs) and inorganic gases at parts-per-trillion (PPT) trace levels.
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DHM Digital Holographic Microscope
Quantum Analytics
(
Booth
5000
)
Instantly capture 3D topography with high-speed, non-contact optical profilometers.
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Sentronics SemDex Metrology Systems
Quantum Analytics
(
Booth
5000
)
High-throughput, non-destructive inspection systems using optical interferometric technologies.
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APPLIED SMARTWEB™ WF
Applied Materials, Inc.
(
Booth
4005
)
Field proven roll-to-roll sputter systems for window films on vehicles and buildings
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APPLIED SMARTWEB™
Applied Materials, Inc.
(
Booth
4005
)
Roll-to-roll sputter coating system for flexible electronics and optical multilayers
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AQUATRAN 3 WVTR
MOCON, Inc.
(
Booth
4012
)
AQUATRAN Model 3 water vapor permeation instrument is designed to increase lab efficiency, streamline operations and improve throughput of ultra hi...
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Metalon Conductive Inks
NovaCentrix
(
Booth
3002
)
Metalon® conductive inks capitalize on advanced materials and formulation to provide conductivity options for additive manufacturing of printed ele...
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PulseForge Invent
NovaCentrix
(
Booth
3002
)
This state-of-the-art photonic curing system is highly configurable for academic budgets and advanced R&D, for development in applications like sen...
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FLEx R2R PECVD
Meyer Burger Technology Ltd.
(
Booth
4002
)
High throughput roll-to-roll plasma coating technology - FLEx R2R PECVD is a thermal plasma-based PECVD piece of production equipment for the depos...
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CONx TFE
Meyer Burger Technology Ltd.
(
Booth
4002
)
For thin film encapsulation of sensitive electronics, Meyer Burger developped integrated tools containing FLEx LT and PiXDRO JETx tools.
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PiXDRO LP50
Meyer Burger Technology Ltd.
(
Booth
4002
)
Advanced research inkjet printer
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