SEMICON West 2016

Sessions Speakers Exhibitors Products Press Releases Floor Plan Buzz

SHENMAO BGA and Micro BGA Bumping Solder Paste

SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process, optimizing manufacturing performance. World’s largest IC OSAT's utilize SHENMAO Bumping Solder Paste.