SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and extremely high quality sphericity. SHENMAO MICRO MATERIAL INSTITUTE applications engineers developed the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. SHENMAO has successfully been approved by many international well-known electronic manufacturers. SHENMAO strives to offer the best quality without compromising cost and time-to-market while providing maximum value to all customers. As the Worlds Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Semiconductor Packaging Solder Spheres, Wafer Bumping Solder Paste, Flux and PV Ribbon.
Product Categories
200 Packaging and Assembly Equipment
- Ball Placement; Attach Systems
- Solder Reflow; Soldering & Brazing Equipment
300 Packaging and Assembly Materials
- Adhesives; Epoxies; Die Attach Compounds; Under fill
- Preforms; Lids
- Solder; Solder Balls and other Soldering Materials
301 Chemicals & Solids
- Other Specialty Chemicals
305 Nanotechnology Materials
- Nanotechnology Materials
306 PV Materials
- Other
700 Manufacturing Services
- Wafer Bumping Service
701 Manufacturing Services or Consulting
- Assembly
- Manufacturing Process Support and Development
- Package Mat'ls; Interconnect; Subassembly Design Svcs