SEMICON West 2016

Sessions Speakers Exhibitors Products Press Releases Floor Plan Buzz

SHENMAO Introduces BGA and Micro BGA Solder Sphere

SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made to various diameters of 0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia. with accurate uniformity and high quality sphericity.