SEMICON West 2016
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TDK Flip Chip Die Bonder
TDK Corporation of America
(
Booth
2405
)
TDK high precision AFM 15 Thermosonic and Thermal Compression Flip Chip Die Bonders. TDK flip chip die bonder uses a micro scrub process to lower energy required and reduce cycle time for die attach process. TDK micro scrub process eliminates flux.
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