TDK is the leading manufacturer of factory automoation equipment
Visit the TDK booth to view a live demonstration of our products on display:
This year TDK is featuring it N2 Purge Equipment Front-End Module (EFEM).
* Mini Environment Control at Critical Process for Next Generation Transistor Manufacturing * Reliable Cost Effective Nitrogen Environment of 50 ppm Oxygen Level Combined with Sealed Design Purge Loadport * Achieves Very Low Wafer Contamination levels for AMC, O2, and RH * Better Process Uniformity and Higher Yields * Best in Class Wafer to Wafer Variation Control
* TAS300 J1 Loadport
* CE Mark Semi Compliant * Over 65,000 Installed at All Major FABS * FAB Proven Interoperability with MCBF Over 750,000 * 30% Improvement in Cycle Time * 50% Reduction is Shipping Package Volume *
* TAS 300mm Nitrogen Purge Loadport
* For Next Generation FABS * 10 Years of Experience with N2 Purge Systems *FAB Proven Interoperability with MCBF Over 750,000 *FAB Proven Design for N2 Bottom Purge FOUPs *
Loadports offer options such as: N2 Purge Field Retrofit, Wafer Mapping, Integrated CID, Integrated E84, Ethernet Communication
Product Categories
200 Packaging and Assembly Equipment
- Die Bonding; Attach Equipment
- Die Sorter; Pick & Place; Flip Chip Placement Systems
701 Manufacturing Services or Consulting
- Wafer Handling