MicroConnex offers fine-line flex circuits and laser microdrilling/machining. Capabilities include flexible printed circuits; high-density, fine-line, and fine-pitch (less than 2 mil trace/space); prototyping to production; laser-drilled blind, buried, and through-hole microvias; laser micromachining and drilling; and thin-film deposition.
Product Categories
- Devices
- Materials
- Processing & Integration