SEMICON Korea 2018
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KOREA NAMICS CO., LTD.
 
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Thixorion®
Al-Si Hybrid Nanocomposite Water-based Thin Film Insulating Coating Agent
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New Pre-Applied underfill Material
Advanced-NCP Advanced-NCF
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Spray coating paste for EMI shielding
Suitable for spray coating with low viscosity. Possible to form thin film shield layer (10 μm or less). High shielding characteristics (over 60 d...
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Capillary Underfill Material
Flip Chip Underfill (UF) CSP/BGA Board Level Underfill (SUF)
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CuTAP® - Copper Treatment Adhesion Promoter
Extremely low profile on copper surface Low signal loss in high frequency applications Suitable for Lithium ion battery as an anode collector
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Liquid Compression Molding Material
Low warpage High reliability Adaptation to various packages (Fan-out, 5SP, CoW etc.) Responding to various filler top cut samples (5 um ~ 45 um)
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