SEMICON Korea 2018

Sessions Speakers Exhibitors Products Press Releases Floor Plan

KOREA NAMICS CO., LTD. 

Thixorion®

Al-Si Hybrid Nanocomposite Water-based Thin Film Insulating Coating Agent More...

Spray coating paste for EMI shielding

Suitable for spray coating with low viscosity. Possible to form thin film shield layer (10 μm or less). High shielding characteristics (over 60 d... More...

Capillary Underfill Material

Flip Chip Underfill (UF) CSP/BGA Board Level Underfill (SUF) More...

CuTAP® - Copper Treatment Adhesion Promoter

Extremely low profile on copper surface Low signal loss in high frequency applications Suitable for Lithium ion battery as an anode collector More...

Liquid Compression Molding Material

Low warpage High reliability Adaptation to various packages (Fan-out, 5SP, CoW etc.) Responding to various filler top cut samples (5 um ~ 45 um) More...