As packaging, wafer level and heterogeneous system assembly in general, electronic systems for future mobility, 5G, AI and Automotive are targeting to find solutions for those key critical aspects of packaging: Performance, Flexibility and Cost competitiveness. Those solutions will make huge connection among system and system such as sensor and logic, logic and memory, antenna and logic. So we are expecting to make a new vision era how packaging as a SIP, FOWLP, 3D IC, and 2.5D IC will open to new market as a heart of 4th industry generation. To address those, chip-packaging-system interaction needs to be better understood. The experts of device design, FABs engineering, packaging, and system need to move closer together. Materials and Equipments need to be developed and tested for electronic systems. Those are the challenging but this session is helping to share the recent advanced packaging information.
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