SEMICON Korea 2018

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Sessions (0)

Plasma & Etching Tutorial (Room #307, COEX)

01 Feb 18
9:00 AM - 11:45 AM

Tracks: Market, STS

Speaker(s): LeeJun Kim ; Jong Chul Park ; Geun Young Yeom
This short course tutorial is designed as basic course for new engineers who is working at etching technology related area. With the practical lect... More...

Information & Control TC Chapter Meeting (Room #305, COEX)

01 Feb 18
10:00 AM - 12:00 PM
The Global Information & Control Technical Committee develops standards that pertain to the interface of manufacturing tools to each other, to ... More...

Market Seminar (Room #318, COEX)

01 Feb 18
10:00 AM - 12:50 PM

Tracks: Market

Speaker(s): Lung Chu ; Jim Feldhan ; Jim Handy ; Mark Thirsk ; Dan Tracy
New application is rising- AI, Automotive in semiconductor industry and it is time to look it up for understanding its impact in semiconductor mark... More...

Metrology and Inspection Forum (Room #402, COEX)

01 Feb 18
10:00 AM - 6:00 PM

Tracks: SMART, Technology

Speaker(s): Benjamin Bunday ; Jack Hager ; Kevin Heidrich ; Philippe Leray ; Seong-Min Ma ; Moshe Preil ; Tuyen K Tran ; Igor Turovets ; Frank van de Mast ; Lu Yu
As device technology shrinks to sub-10 nm, we expect a lot of challenges in process integration. Thus, many chip makers are considering EUV lithogr... More...

S4. Plasma Science and Etching Technology (Room #307, COEX)

01 Feb 18
1:00 PM - 5:30 PM

Tracks: STS

Speaker(s): Rod Boswell ; Junsic Hong ; Yoojin Kim ; Yoonjae Tyler Kim ; Gon-Ho Kim ; Mark J Kushner ; Jung-Sik Yoon ; Ying Zhang
These days the semiconductor business is expanding more rapidly since Big Data and AI (Artificial Intelligence) technologies need plenty of chips a... More...

S5. Contamination-free Manufacturing and CMP Technology (Room #308, COEX)

01 Feb 18
1:00 PM - 5:10 PM

Tracks: STS

Speaker(s): Heesook Cheon ; Sidney Huey ; Keebum Jung ; Sangsoo Kim ; Deok Yeon Lee ; Sunghoon Lee ; Dan Rodier ; Jaejin Shin ; Guy Vereecke
Continuous shrinkage of device dimension to nm level requires new materials and novel device structure which demand a new paradigm in contamination... More...

S6. Electopackage System and Interconnect Product (Room #317, COEX)

01 Feb 18
1:00 PM - 6:25 PM

Tracks: STS

Speaker(s): Jungsoo Byun ; Junghoon Cha ; Seung-Hyun Chae ; Christian Goetze ; Taek-Soo Kim ; YoungRae Kim ; Tae-Hoon Kim ; Santosh Kumar ; Oscar Shih ; Paul F. Werbaneth ; Seung Wook Yoon ; Se-Ho You
As packaging, wafer level and heterogeneous system assembly in general, electronic systems for future mobility, 5G, AI and Automotive are targeting... More...

Smart Manufacturing Forum (Room #301, COEX)

01 Feb 18
1:00 PM - 4:30 PM

Tracks: SMART

Speaker(s): James Chae ; Kyoung Shik Jun ; Jan Rothe ; Jason Shields ; Teck Khiong Woi
Technology is evolving at lightning speed – faster than ever before. The increasing adoption of IoT technologies, robotics, automation, softw... More...

MI Reception (Room #402, COEX)

01 Feb 18
6:00 PM - 7:00 PM

Tracks: STS

MI Reception is a special event for MI industry to build the global networking through supply chain and to get together for business opportunities.... More...