2018FLEX

Sessions Speakers Exhibitors Products Press Releases Floor Plan Buzz
Search

Sessions (11)

Short Course 1: From Lab to Fab: Materials, Printing and Processing of Flexible Hybrid Electronics (Room Spyglass)

12 Feb 18
9:00 AM - 12:00 PM

Tracks: IC/Hybrid Integration, Integration, Manufacturing on Flex, Materials, Products

Speaker(s): Michael Mastropietro ; Mark Poliks ; James Watkins
1. From Lab to Fab: Materials, Printing and Processing of Flexible Hybrid Electronics Mark Poliks, Binghamton University, James J. W... More...

MSTC Session 4: MATERIALS & CHARACTERIZATION

14 Feb 18
10:15 AM - 1:20 PM

Tracks: 2018 MSTC Full Conference

MSTC Session 4:  MATERIALS & CHARACTERIZATION:  10:15am-1:20pm 10:15-10:20 Session ... More...

Flexible Haptic Actuators -- Like you never felt before (Room Big Sur)

15 Feb 18
1:40 PM - 2:00 PM

Tracks: 2018FLEX Full Conference, Products

Speaker(s): Sri Peruvemba
Session 20: Next Gen Advancements Flexible Haptic Actuators -- Like you never felt before Thursday, February 15, 2018 1:40 PM - 2:00 PM ... More...

Short Course 3: Flexible Device Integration & Packaging (Room Cypress)

12 Feb 18
1:00 PM - 4:00 PM

Tracks: IC/Hybrid Integration, Integration, Manufacturing on Flex, Products

Speaker(s): Kurt Christenson ; Douglas Hackler ; Pradeep Lall
3. Flexible Device Integration & Packaging Pradeep Lall, Auburn University In this course, manufacture, design, assembly, and accelera... More...

MSTC Session 5: APPLICATIONS

14 Feb 18
1:20 PM - 3:55 PM

Tracks: 2018 MSTC Full Conference

MSTC Session 5:  APPLICATIONS:  1:20pm-3:55p 1:20-1:25 Session Moderator:  Nicole ... More...

PDMS films for printed electronics - Methods and Advancements (Room Big Sur)

15 Feb 18
2:00 PM - 2:25 PM

Tracks: 2018FLEX Full Conference, Materials, Printed Electronics

Speaker(s): Victoria Tran
Session 20: Next Gen Advancements PDMS films for printed electronics - Methods and Advancements Thursday, February 15, 2018 2:00 PM - 2:2... More...

Flexible Oral Biosensing Platform (Room Big Sur)

14 Feb 18
8:25 AM - 8:45 AM

Tracks: 2018FLEX Full Conference, IC/Hybrid Integration, Integration, Manufacturing on Flex, MedTech, Our Funded R&D Projects, Printed Electronics, Products, Sensors & Sensor Networks

Speaker(s): David Schwartz
Session 5: Health Monitors Flexible Oral Biosensing Platform Wednesday, February 14, 2018 8:25 AM - 8:45 AM PARC and UCSD are developi... More...

Session 11: Flexible Electronics Applications II (Room Big Sur)

14 Feb 18
3:55 PM - 5:40 PM
Session 11: Flexible Electronics Applications II Perovskite solar cells on flexible glass Wednesday, February 14, 2018 3:55 PM - 4:20 PM ... More...

Advancements in the manufacture of roll-to-roll smart and innovative devices by addressing production scalability and technology challenges (Room Big Sur)

15 Feb 18
2:45 PM - 3:05 PM

Tracks: 2018FLEX Full Conference, Business Related, IC/Hybrid Integration, Manufacturing on Flex

Speaker(s): Nessima Kaabeche
Session 20: Next Gen Advancements Advancements in the manufacture of roll-to-roll smart and innovative devices by addressing production scalabil... More...

Novel Materials for MEMS Packaging

14 Feb 18
10:50 AM - 11:20 AM

Tracks: 2018 MSTC Full Conference, Integration, Materials

Speaker(s): Markus Schindler Ph.D.
Session 4: Markus Schindler, Ph.D. Wednesday February 14, 2018 at 10:50 AM Markus Schindler, Ph.D. Product Manager... More...

Session 13: Emerging Capabilities (Room Spyglass)

15 Feb 18
8:00 AM - 9:45 AM
Session 13: Emerging Capabilities A Holistic Approach to Thermal Management in Flexible/Hybrid Electronics Using Carbon Fiber Technology Thursd... More...

Water Vapor Transmission Rate (WVTR) Measurements for Ultra-High Barrier Materials used in the Display Industry (Room Big Sur)

15 Feb 18
3:05 PM - 3:25 PM

Tracks: 2018FLEX Full Conference, Materials

Speaker(s): Georgia Gu
Session 20: Next Gen Advancements Water Vapor Transmission Rate (WVTR) Measurements for Ultra-High Barrier Materials used in the Display Industr... More...

Sensor / ASIC integration challenges for automotive and industry 4.0 and how to tackle them

14 Feb 18
1:55 PM - 2:25 PM

Tracks: 2018 MSTC Full Conference, Applications, Integration, Sensors & Sensor Networks

Speaker(s): Jeroen Van Ham
Session 5: Jeroen Van Ham, Ph.D Wednesday February 14, 2018 at 1:55 PM Jeroen Van Ham, Ph.D Business Development M... More...

Session 18: FHE Chip Integration (Room Cypress)

15 Feb 18
10:15 AM - 12:00 PM
Session 18: FHE Chip Integration Investigation of Ultrathin/High IO Die Attach to Flexible Substrates Thursday, February 15, 2018 10:15 A... More...

Potentials of System-in-Package Technologies for Future Bosch Products (Room Big Sur)

14 Feb 18
5:20 PM - 5:40 PM

Tracks: 2018FLEX Full Conference, IC/Hybrid Integration, Integration, Sensors & Sensor Networks

Speaker(s): Martin Giersbeck
Session 11: Flexible Electronics Applications II Potentials of System-in-Package Technologies for Future Bosch Products Wednesday, February 14,... More...

Session 20: Next Gen Advancements (Room Big Sur)

15 Feb 18
1:40 PM - 3:25 PM
Session 20: Next Gen Advancements Flexible Haptic Actuators -- Like you never felt before Thursday, February 15, 2018 1:40 PM - 2:00 PM ... More...

A Holistic Approach to Thermal Management in Flexible/Hybrid Electronics Using Carbon Fiber Technology (Room Spyglass)

15 Feb 18
8:00 AM - 8:25 AM

Tracks: 2018FLEX Full Conference, Emerging Technologies, Integration, Materials

Speaker(s): MP Divakar
Session 13: Emerging Capabilities A Holistic Approach to Thermal Management in Flexible/Hybrid Electronics Using Carbon Fiber Technology Thursd... More...

Investigation of Ultrathin/High IO Die Attach to Flexible Substrates (Room Cypress)

15 Feb 18
10:15 AM - 10:40 AM

Tracks: 2018FLEX Full Conference, IC/Hybrid Integration, Integration

Speaker(s): Michael Santos
Session 18: FHE Chip Integration Investigation of Ultrathin/High IO Die Attach to Flexible Substrates Thursday, February 15, 2018 10:15 A... More...

Flexible (1mm bending radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6µm) and Reliable Flexible Cu-based Interconnects (Room Cypress)

15 Feb 18
10:40 AM - 11:00 AM

Tracks: 2018FLEX Full Conference, IC/Hybrid Integration, Integration, Our Funded R&D Projects

Speaker(s): Amir Hanna
Session 18: FHE Chip Integration Flexible (1mm bending radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported... More...

Low Temperature flip chip bonding technology applicable to flexible hybrid electronics in the IoT era (Room Cypress)

15 Feb 18
11:20 AM - 11:40 AM

Tracks: 2018FLEX Full Conference, IC/Hybrid Integration, Integration

Speaker(s): Hiroshi Komatsu
Session 18: FHE Chip Integration Low Temperature flip chip bonding technology applicable to flexible hybrid electronics in the IoT era Thursday... More...

A "Flexible" solution for Internet of Things (Room Big Sur)

15 Feb 18
2:25 PM - 2:45 PM

Tracks: 2018FLEX Full Conference, Integration, Products, Sensors & Sensor Networks

Speaker(s): Abhilash Iyer
Session 20: Next Gen Advancements A "Flexible" solution for Internet of Things Thursday, February 15, 2018 2:25 PM - 2:45 PM ... More...