2018FLEX

Sessions (11)

Short Course 1: From Lab to Fab: Materials, Printing and Processing of Flexible Hybrid Electronics (Room Spyglass)

12 Feb 18
9:00 AM - 12:00 PM

MSTC Session 4: MATERIALS & CHARACTERIZATION

14 Feb 18
10:15 AM - 1:20 PM

Flexible Haptic Actuators -- Like you never felt before (Room Big Sur)

15 Feb 18
1:40 PM - 2:00 PM

Short Course 3: Flexible Device Integration & Packaging (Room Cypress)

12 Feb 18
1:00 PM - 4:00 PM

MSTC Session 5: APPLICATIONS

14 Feb 18
1:20 PM - 3:55 PM

PDMS films for printed electronics - Methods and Advancements (Room Big Sur)

15 Feb 18
2:00 PM - 2:25 PM

Flexible Oral Biosensing Platform (Room Big Sur)

14 Feb 18
8:25 AM - 8:45 AM

Session 11: Flexible Electronics Applications II (Room Big Sur)

14 Feb 18
3:55 PM - 5:40 PM

Advancements in the manufacture of roll-to-roll smart and innovative devices by addressing production scalability and technology challenges (Room Big Sur)

15 Feb 18
2:45 PM - 3:05 PM

Novel Materials for MEMS Packaging

14 Feb 18
10:50 AM - 11:20 AM

Session 13: Emerging Capabilities (Room Spyglass)

15 Feb 18
8:00 AM - 9:45 AM

Water Vapor Transmission Rate (WVTR) Measurements for Ultra-High Barrier Materials used in the Display Industry (Room Big Sur)

15 Feb 18
3:05 PM - 3:25 PM

Sensor / ASIC integration challenges for automotive and industry 4.0 and how to tackle them

14 Feb 18
1:55 PM - 2:25 PM

Session 18: FHE Chip Integration (Room Cypress)

15 Feb 18
10:15 AM - 12:00 PM

Potentials of System-in-Package Technologies for Future Bosch Products (Room Big Sur)

14 Feb 18
5:20 PM - 5:40 PM

Session 20: Next Gen Advancements (Room Big Sur)

15 Feb 18
1:40 PM - 3:25 PM

A Holistic Approach to Thermal Management in Flexible/Hybrid Electronics Using Carbon Fiber Technology (Room Spyglass)

15 Feb 18
8:00 AM - 8:25 AM

Investigation of Ultrathin/High IO Die Attach to Flexible Substrates (Room Cypress)

15 Feb 18
10:15 AM - 10:40 AM

Flexible (1mm bending radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6µm) and Reliable Flexible Cu-based Interconnects (Room Cypress)

15 Feb 18
10:40 AM - 11:00 AM

Low Temperature flip chip bonding technology applicable to flexible hybrid electronics in the IoT era (Room Cypress)

15 Feb 18
11:20 AM - 11:40 AM

A "Flexible" solution for Internet of Things (Room Big Sur)

15 Feb 18
2:25 PM - 2:45 PM