Abstract:
systeMECH is developing a manufacturing technology for transferring thin, high-performance semiconductor components directly onto flexible substrates in order to build flexible hybrid electronic devices. In addition to being able to transfer components that are thinner and laterally smaller than those that can be supported by conventional tools, a key differentiator of our technology is that only a single transfer-printing step is involved, thus eliminating the time and materials required to handle fragile IC components with a temporary carrier. Printing tools and processes based on our core technology will significantly lower the technological barriers that are hindering the widespread manufacture of flexible devices that integrate high-performance semiconductors, including single-crystalline silicon, into their architectures.