Abstract:
Heat is a barrier to innovation in electronic devices. But after nearly 25 years of intensive development of science at the nanoscale, marked by numerous important discoveries, we now have a tremendous amount of knowledge and tools to exploit nanoscience to eliminate heat barriers. Carbice Nanotechnologies is leading new frontiers of technology to eliminate heat…enabling a new wave of product innovations in the electronics industry. With over $6 million invested in R&D since 2009 to validate carbon nanotubes as the best material for dissipating heat in electronics, Carbice has now launched a commercial product based on vertically aligned carbon nanotube arrays to overcome heat barriers in testing, servers, and IoT devices. In this talk, I will share a few results from in-house and customer testing of our product for chip testing applications. I will also share testing results for use of our product in server packaging, and for IoT heat spreading and touch temperature management. Some previous research and failed commercialization efforts have clouded thoughts on the commercial viability of carbon nanotubes for heat dissipation. Since we have received the most research funding in this space, produced the most highly cited scholarship, and are now selling a product with a clear and strong value proposition, I will make a strong case for why the second coming of carbon nanotubes is here, breaking through heat barriers at a market competitive price point, and why this is a fact that leading companies in the electronics business cannot afford to overlook.