Abstract:
Today’s memory packages continue to drive the development of wire bonding equipment solutions in order to handle increasingly thinner die, taller die stacks, and complex three-dimensional die stacking arrangements. These challenges require innovative wire bond solutions to deliver high-reliability interconnects for these packages. The IConn MEM PLUS ball bonder is optimized for memory package assembly and is built on the successful and industry leading IConn PLUS wire bonder platform. This wire bonder introduces newly developed hardware and process capabilities to improve throughput and yield, while addressing the growing complexities of stacked-die memory packages. Designed for performance, the IConn MEM PLUS is developed to maximize productivity and achieve the lowest cost of ownership by leveraging the latest process technology for bonding with both silver alloy and gold wire. The IConn MEM PLUS is well-positioned to meet the demands of NAND and DRAM packages today and into the future.