Test Vision 2020 presents: Adapting to the New Realities of Test

Wednesday, July 13, 10:30am-4:20pm 
Thursday, July 14, 10:30am-4:00pm

Test Vision 2020 is today's premier workshop for semiconductor and system test experts to look into the future of test and discuss coming trends and requirements.  It's a highly anticipated gathering of providers and users of test IP and equipment - all converging to hear and engage with leaders in the field.  The conference typically has 100+ participants and is held in conjunction with SEMICON West, assuring access to a wide range of expertise and experience.  

This year’s theme is "Adapting to the New Realities of Test".  While the semiconductor classic front-end Moore’s Law physical and cost scaling is near an end, the pace to adopting advanced packaging technologies such as 2.5D and 3D is accelerating.  The focus is now shifting to feature integration density, whether through on-die 3-D stacking (NAND, X-Point) or heterogeneous integration of different die in the same package.  This trend is significantly impacting the wafer and final test strategy and cost considerations.   Test is now evolving from primarily a pass/fail exercise only, to a process that is adapting to the needs of newer devices.  This has taken the form, for example, repairing and calibrating devices to enable the latest fab processes and improve yield, securitization of test, or the optimization of test and production flows based on "big data" gathered during the manufacturing process.  In many cases, yield and costs are not sustainable, or devices are simply non-functional without a highly developed test strategy.

Perspectives to be Presented at SEMICON West:  

With these topics as the backdrops, we intend to spark lively debate. This means picking apart the overall device production process and examining how test could in fact become its ultimate “enabler”.    

“Moore’s Law” and “More than Moore” packaging advancements still guide our roadmaps as the race for denser, larger, faster and highly heterogeneous devices continues. Now, add the near-instantaneous time-to-market imperatives and the new challenges of 10nm processes and beyond, and the test complexities intensify. This calls for new innovations in DFT, test engineering, wafer probing technology and device manufacturing - to build valuable solutions for test IP and equipment developers, as well as tool providers and users.

So, at Test Vision 2020, we’ll address questions like this: What can we do differently to provide probably-good-enough testing cost effectively? What R & D tools are needed for today’s and tomorrow’s devices? What will test cell (ATE, handlers or probers, probe cards) need to look like in 2016 and 2030? Are today’s technologies adequate for the future? If not what can we do to close the gap?

Registration  

Test Reception on Wednesday after the session included with Registration