The pace of scaling has been thrown a bit off its “usual” schedule in the last few years, and there is hope that advances in 3D ICs and novel packaging technologies will help ease the industry’s anxieties about the reduced pace and increasing costs. That said, to enable greater functionality in ever more portable platforms, the industry needs to keep scaling alive for as long as possible. This session covers the challenges and potential solutions as the industry strives to get to node 5. Covered topics include materials and process R&D challenges (to get to node 5) as well as alternatives to transistor structures (e.g., nanowires, TFETs).
Registration
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By June 3 |
Starting June 4 |
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SEMI Member
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$125
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$175
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Non Member
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$175
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$225
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