Garching, September 6, 2016 – SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, today announced the launch of its new generation of the fully automated ACS300 platform. The modular system of the ACS300 Gen3 is specifically designed for high volume manufacturing of advanced packaging applications such as wafer-level chip-scale packaging, fan-out wafer-level packaging, copper pillar flip-chip and 3D packaging.
The tool addresses the needs of a highly competitive and cost-sensitive market. Efficient module stacking allows for the smallest footprint for a system with eight coaters and developers on the market, saving costly cleanroom space. The three-level modular system delivers high yield and throughput by fast and precise robots, intelligent scheduling algorithms and a highly advanced monitoring system. The ACS300 Gen3 provides for simultaneous 200 mm and 300 mm wafer processing without the need for a mechanical changeover. In addition, the tool can be equipped to handle 330 mm and warped wafers with a warpage of up to 10mm. The ability to process multiple wafer shapes and sizes as well as various coat and develop materials makes the platform an efficient all-in-one solution. State-of-the-art chemical-saving features address economic as well as ecological concerns, working in line with even the most rigid sustainability standards.
“The ACS300 Gen3 is our new flagship for the advanced packaging market. Having worked in close collaboration with our customers, we have created a platform that really excels. We are very excited to present some new groundbreaking functions. The ACS300 Gen3 stands for high process stability, repeatability and yield. For example, it has more sensors for logging and control than any coating system SUSS MicroTec has ever produced”, says Gary Choquette, General Manager of the Coater/Developer product line. “With this brand new generation of the ACS300, we supply our customers with a high-quality, state-of-the-art tool at a very favorable cost of ownership.”
About SUSS MicroTec
SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit www.suss.com