SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.
In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and Nanoimprint Lithography as well as key processes for WLP, MEMS and LED manufacturing. With its global infrastructure for applications and service SUSS MicroTec supports more than 8,000 installed systems worldwide.
Product Categories
200 Packaging and Assembly Equipment
- Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
- Wafer Level Bonders
201 Flat Panel Display Equipment
- Alignment Film Coating Equipment
202 Other Equipment
- Cutting; Drilling; Laser ablation; Beveling Equipment
203 Inspection & Measurement Products
- Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
- Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
204 MEMS Equipment
- Double sided mask aligner
- Wafer Level Bonders
205 Nanotechnology Equipment and Tools
- Equipment, Nanotechnology Tools
207 Process Equipment
- Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
- Coat; Develop; Resist Processing; Track Equipment
- Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
- SOI Bonders; Temporary Bonders; De-Bonders
304 Mask Making Materials
- Mask and Reticle Handling Products
701 Manufacturing Services or Consulting
- Wafer Handling