SEMICON Korea 2018
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ELD300 Debonder
SUSS MicroTec AG
(
Booth
D530
)
The ELD300 debond module supplements the SUSS MicroTec product portfolio for laser-based wafer processing. The ELD300 module is designed to debond glass carriers from full thickness wafers or thinned 200/300mm tape-frame mounted wafers.
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