Lithoglas designs, manufactures and markets wafer-level hermetic structured borosilicate glass layers for packaging of Optoelectronics, MEMS or MOEMS devices. We address growth markets like passivation or encapsulation of electronic components and semiconductors for automotive LED arrays, automotive MEMS, MOEMS or Bio-MEMS and others.
Using Lithoglas technologies, the sensitive chip areas are sealed directly by glass thin film deposition or glass cap encapsulation on wafer-level. This promotes plastic-molded packages to a high reliability level for replacing costly conventional packages like glass-metal or ceramics.
Lithoglas passivations provide a direct hermetic and transparent sealing of the chip surface to promote cost-efficient packages of reduced size.
Our substrates are glass capping solutions bonded at wafer-level to enable chip size packages, but can also be designed to fit for conventional chip-on-board packaging.
Lithoglas wafer-level-capping provides the advantage of placing several thousand glass caps simultaneously with high precision in a clean-room environment assuring high quality and a minimum defect rate.
Product Categories
- Automation Sensors
- Flow
- Force/Strain/Load/Torque
- Infrared Detectors
- Machine Vision
- Moisture/Humidity
- Optical
- Presence/Proximity
- Pressure
- Sensors/System Components