Product Categories
200 Packaging and Assembly Equipment
- Backgrind; Slicing; Lapping; Polishing Equipment
- Cleaning; Washing Equipment for Assembly & Packaging
- Dicing; Sawing; Scribing; Separation Equipment
- Die Bonding; Attach Equipment
- Die Sorter; Pick & Place; Flip Chip Placement Systems
- Wafer Level Bonders
202 Other Equipment
- Cutting; Drilling; Laser ablation; Beveling Equipment
204 MEMS Equipment
- Deep RIE etching; Dry Etching
- Wafer Level Bonders
207 Process Equipment
- Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
- Etching; Stripping; Ashing - Dry and Wet Equipment
600 Communication Software
- Equipment Interface; Communication Protocols
602 Manufacturing Software
- Factory Automation; Cell Controller Software
701 Manufacturing Services or Consulting
- Assembly
- Flat Panel Display (FPD) Design & Manufacturing
- Manufacturing Process Support and Development
- Wafer Handling