SEMICON Europa 2016

Pibond Oy 

Booth 541

Espoo,   
      Finland

We manufacture a broad range of unique electronic materials, which meet customers' stringent performance and integration requirements. We currently supply materials from our product lines to leading foundries and IDMs all over the world.



We specialize in the development and production of advanced siloxane and metal oxide monomers and polymers. Many of the products we manufacture are essential in construction of new and next generation devices for helping to maximize resolution, increase yield and reduce production costs. Our materials are currently being used by customers at multiple nodes including “10 nm class” advanced semiconductor devices.



The expertise we have in product development, application engineering and state-of-the-art production techniques ensures fast time to market for customers, delivering the performance required for even the most advanced device designs.



Apart from being used at multiple nodes within the semiconductor industry, PiBond also offers and develops materials for MEMS and Advanced IC Packaging. Industrial trends like The Internet of Things are increasing the demands for Wafer Level and emerging 3D-IC packaging architectures. 


Product Categories

300 Packaging and Assembly Materials
- Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
- Thick Film Pastes; Materials
- Thin Film; Dielectric Film Materials

301 Chemicals & Solids
- Other Specialty Chemicals
- Spin on glass material
- Surface protection material; coatings

302 FPD Materials
- Spacer Materials

305 Nanotechnology Materials
- Nanotechnology Materials

307 Process Materials
- Deposition Supplies
- Deposition/Target Materials

701 Manufacturing Services or Consulting
- Nanotechnology Intellectual Property Development; Research
- Package Materials; Interconnect; Subcomponent; Subassembly Design Services

901 Printed, Organic, Flexible and Large Area
- Materials: Consumables
- Materials: Inorganic
- Materials: Organic
- Materials: Other
- Materials: Substrates, encapsulation, packaging
- Services: Research and Development