With more than 20 years of experience, PacTech is a prime manufacturer of leading-edge technology equipment and processes for the advanced packaging industry. PacTech designs, manufactures and supports solder jetting equipment, wafer-level solder ball transfer systems, wafer-level solder rework equipment, laser assisted flip-chip bonders and automatic plating tools for high volume eless Ni/Au and Ni/Pd/Au UBM and OPM through its global sales network.
In Europe, the U.S. and Malaysia, the full enterprise portfolio of different manufacturing services is available, as well as all of the backend solutions.
PacTech offers the capability to do demonstration including samples and prototyping under ISO certified production conditions. More over PacTech has an unique dual business model in which it offers its customers especially low volume production customers or new starters in to that industry the option to use in the initial phase PacTech’s demo centers for services. After qualification of the product the customer has the option of further cost reduction by having full turnkey solution with equipment, process and technology.
Product Categories
200 Packaging and Assembly Equipment
- Ball Placement; Attach Systems
- Solder Reflow; Soldering & Brazing Equipment
- Wafer Level Bonders
202 Other Equipment
- Repair; Rework Equipment
207 Process Equipment
- Bumping Systems
700 Manufacturing Services
- Repair; Rebuild; Install Equipment; Maintenance Services; Spare Parts
- Sawing; Lapping; Grinding; Polishing Service
- Wafer Bumping Service