systeMECH is developing tools and processes based on our patented direct-transfer printing technology for transferring thin, high-performance semiconductor components onto flexible substrates in order to build flexible hybrid electronic (FHE) devices. In addition to being able to transfer components that are thinner and laterally smaller than those that can be supported by conventional tools, a key differentiator of our technology is that only a single transfer-printing step is involved, thus eliminating the time and materials required to handle fragile IC components with a temporary carrier. Printing tools and processes based on our core technology will significantly lower the technological barriers that are hindering the widespread manufacture of flexible devices that integrate high-performance semiconductors into their architectures.
Product Categories
200 Packaging and Assembly Equipment
- Die Sorter; Pick & Place; Flip Chip Placement Systems
701 Manufacturing Services or Consulting
- Assembly