SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, and CVD wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets.
With the addition of SPTS, Orbotech is able to offer a broader range of process solutions for Advanced Packaging, which includes Orbotech’s Inkjet solutions for die level printing of package marking, underfill dams and isolation layers.
SPTS has manufacturing facilities in Newport, Wales and Allentown, Pennsylvania, and operates across 19 countries in Europe, North America and Asia-Pacific.
For additional product or company information, please visit:
www.spts.com
www.orbotech.com
Product Categories
200 Packaging and Assembly Equipment
- Dicing; Sawing; Scribing; Separation Equipment
204 MEMS Equipment
- Deep RIE etching; Dry Etching
205 Nanotechnology Equipment and Tools
- Equipment, Nanotechnology Tools
207 Process Equipment
- Bumping Systems
- Deposition; (CVD, PVD, ALD, Plating)
- Deposition; PVD; Sputtering; Evaporation Equipment
- Etching; Stripping; Ashing - Dry and Wet Equipment
- Thermal Processing