Palomar Technologies, a former subsidiary of Hughes Aircraft, is the global leader of die attach solutions, wire bonding equipment, optoelectronic packaging systems and contract assembly services. Customers utilize the products, services and solutions from Palomar Technologies to obtain precision wire and ball bonders and automated component placement systems. Palomar Technologies Assembly Services (TM) is the contract assembly, process development, prototyping and test division of Palomar Technologies. Customers utilize the solutions from Assembly Services to achieve high-precision, high-accuracy die attach and wire bonding services without the need to invest in capital equipment.
Product Categories
200 Packaging and Assembly Equipment
- Ball Placement; Attach Systems
- Device Handling; Feeding Systems
- Die Bonding; Attach Equipment
- Die Sorter; Pick & Place; Flip Chip Placement Systems
- Dispensing Systems
- Package Handling; Conveying Equipment
- Solder Reflow; Soldering & Brazing Equipment
- Wire Bonding Equipment
203 Inspection & Measurement Products
- Die Inspection; Die Shear
- Wire Bonding Inspection; Test
204 MEMS Equipment
- Wafer Level Bonders
207 Process Equipment
- Bumping Systems
208 Test Equipment
- Handlers; Positioner Systems
300 Packaging and Assembly Materials
- Adhesives; Epoxies; Die Attach Compounds; Under fill
- Bonding; Interconnect: Wire/Ribbon/Tape/Capillaries/Tools
- Solder; Solder Balls and other Soldering Materials
602 Manufacturing Software
- Production Control software
- Yield Mgmt; Process Control Software
700 Manufacturing Services
- Wafer Bumping Service
701 Manufacturing Services or Consulting
- Assembly
- Wafer Handling