Product Categories
200 Equipment, Assembly
- Ball Placement; Attach Systems
- Die Bonding; Attach Equipment
- Die Removal Equipment
- Die Sorter; Pick & Place; Flip Chip Placement Systems
- Dispensing Systems
- Wafer Level Bonders
- Wire Bonding Equipment
202 Equipment, General Use
- Cutting; Drilling; Laser ablation; Beveling Equipment
- Repair; Rework Equipment
203 Equipment, Inspection & Measurement
- Die Inspection; Die Shear
204 Equipment, Mems
- Wafer Level Bonders
206 PV Equipment
- Wafers
300 Materials, Assembly
- Adhesives; Epoxies; Die Attach Compounds; Under fill Materials; Conductive & Non-Conductive
- Molding; Encapsulation; Potting; Resin Materials
- Solder; Solder Balls and other Soldering Materials
400 Components, Parts & Accessories
- Gaskets; Seals; O rings; Elastomers; Resins
- Sealants; Adhesives; Finishes
700 Manufacturing Services
- Micro Machining services (small hole drilling and milling)
- Wafer Bumping Service
701 Manufacturing Services or Consulting
- Wafer Handling
901 Solar
- Solar thermal applications for heating, process heat and cooling
903 LED
- Heat-conduction Material for LED, Optical Lens