The Electroplating equipment pioneer for Semiconductor, TKC Co.,Ltd.!
TKC which has supplied plating and surface processing equipments for mass production since 1996 and succeeded in developing package related plating equipments since 2009 is moving forward to the specialized manufacturing company for mass production Wafer Plating Equipment with productivity and quality competitiveness.
Product:
1. Wafer EP equip. (RDL, BUMP, TSV)
2. Single Cell EP equip.
3. Wafer Cu-Ni-Au Plating equip. for LED
4. Pattern copper Plating equip. (Vertical continuous plating)
5. Panel via fill copper plating equip. (Vertical continuous plating)
6. full auto Ni-Au Plating equip.
7. Non-contact vertical DF / SR develop equip.
8. vertical auto desmear / PTH
Product Categories
200 Equipment, Assembly
- Plating; Electro Chemical Plating for device assembly
207 Equipment, Process
- Etching; Stripping; Ashing - Dry and Wet Equipment
301 Materials, Chemicals & Solids
- Other Specialty Chemicals
500 Factory Monitoring & Control Systems (FMCS)
- Equipment Interface; Communication Protocols
700 Manufacturing Services
- Plating; Electro Polishing; Coating; Surface Treatment