CONNECTEC JAPAN specializes in semiconductor assembly business “OSRDA” (Outsourced Semiconductor Research, Development & Assembly), which provide clients a one-stop solution including substrate design, structure proposal, process development, proto-typing, evaluation, analysis and mass-production.
Our unique MonsterPAC® , Low-Temperature (down to 80 deg C), Low-load and Less-damage Flip Chip bonding and component assembly technologies will not only minimize harmful effects on subtle sensor chips or MEMS devices, but also make it possible to assemble such chips onto heat intolerant flexible substrates, including PET film and PU film.
We will also develop semiconductor related applications in cooperation with our partner companies.
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Product Categories
- Applications
- Devices
- Materials
- Processing & Integration
- Technical Services & Facility Time