For over 40 years, DISCO Hi-Tec America, Inc. has been a leader in the semiconductor industry in cutting (Kiru), grinding (Kezuru), and polishing (Migaku) technologies. DISCO's focus has expanded beyond mechanical dicing to include laser and plasma singulation. DISCO continues to be the leader in wafer thinning and polishing/stress relief with technologies such as SDBG enabling thinning of die to 20um or less. To support the increasing complexity in today's packages, DISCO has also released equipment capable of laser via drilling in non-silicon transparent materials, silicon carbide ingot slicing (KABRA), and laser lift off. In order to support research and development efforts, joint development initiatives, and next generation product prototyping, DISCO Hi-Tec America's KKM Services lab in Santa Clara offers capability to process materials with our latest advanced cutting, grinding, and polishing technologies.
Product Categories
- Processing & Integration
- Technical Services & Facility Time
- Tools & Equipment