Ehwa launched on Semiconductor Div. on April, 2007 separated from Industrial Division. Since its establishment, Ehwa has been acting as a leading purveyor of diamond tools for Semiconductor and LED inndustries. We would like to be a stepping stone of our customer’s sustaining growth.
Product Categories
200 Equipment, Assembly
- Backgrind; Slicing; Lapping; Polishing Equipment
- Dicing; Sawing; Scribing; Separation Equipment
202 Equipment, General Use
- Cutting; Drilling; Laser ablation; Beveling Equipment
207 Equipment, Process
- Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
300 Materials, Assembly
- Scribe Tools; Saw or Dicing Blades and Accessories
307 Materials, Process
- CMP; Grind; Lap; Polish; Abrasive materials
- Plating Materials
700 Manufacturing Services
- Plating; Electro Polishing; Coating; Surface Treatment
701 Manufacturing Services or Consulting
- Flat Panel Display (FPD) Design & Manufacturing
903 LED
- FPD Glass Substrate Processing Equipment, Materials and Parts