To be the leading integrated system and materials supplier to the global microelectronics industry, ASM offers complete factory automation solutions to customers for their assembly and packaging needs and providing total customer satisfaction with our innovative, cost-effective products. Our solutions cover various packaging markets, including, LED, IC, COB, display related packages, discrete packages, SMT manufacturing solutions and more...... With our commitment of total customer satisfaction, we also provide cost effective and flexible in-line integration (IDEALine™) for your assembly floor linking.
Product Categories
200 Equipment, Assembly
- Ball Placement; Attach Systems
- Cut & Down Set; Trim; Form Equipment
- Die Bonding; Attach Equipment
- Die Sorter; Pick & Place; Flip Chip Placement Systems
- Dispensing Systems
- Molding; Encapsulation; Decapsulation Equipment
- Solder Reflow; Soldering & Brazing Equipment
- Wafer Level Bonders
- Wire Bonding Equipment
204 Equipment, Mems
- Wafer Level Bonders
207 Equipment, Process
- Bumping Systems
300 Materials, Assembly
- Lead Frames & Headers: Etched; Stamped