SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SUSS MicroTec supports more than 8.000 installed systems worldwide. SUSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit http://www.suss.com
                        
                            Product Categories
                        
                        
                                
                                    101 Photovoltaic Device Manufacturing
                                    
                                
                                
                                        - PV: Stand-Alone Systems
                                        
                                    
                                
                            
                                
                                    200 Equipment, Assembly 
                                    
                                
                                
                                        - Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
                                        
                                    
                                        - Wafer Level Bonders
                                        
                                    
                                        - Wafer Mount; Taping Equipment
                                        
                                    
                                
                            
                                
                                    201 Equipment, Flat Panel Display
                                    
                                
                                
                                        - Alignment Film Coating Equipment
                                        
                                    
                                
                            
                                
                                    202 Equipment, General Use
                                    
                                
                                
                                        - Repair; Rework Equipment
                                        
                                    
                                
                            
                                
                                    203 Equipment, Inspection & Measurement
                                    
                                
                                
                                        - Overlay Measurement
                                        
                                    
                                
                            
                                
                                    204 Equipment, Mems
                                    
                                
                                
                                        - Wafer Level Bonders
                                        
                                    
                                
                            
                                
                                    205 Equipment, Nanotechnology
                                    
                                
                                
                                        - Equipment, Nanotechnology Tools
                                        
                                    
                                
                            
                                
                                    207 Equipment, Process
                                    
                                
                                
                                        - Bumping Systems
                                        
                                    
                                        - Coat; Develop; Resist Processing; Track Equipment 
                                        
                                    
                                        - Lithography; Exposure; Aligners; Direct Write Systems; Steppers; Scanners; Nanoimprint
                                        
                                    
                                        - SOI Bonders; Temporary Bonders; De-Bonders
                                        
                                    
                                        - Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment 
                                        
                                    
                                
                            
                                
                                    301 Materials, Chemicals & Solids
                                    
                                
                                
                                        - Photo Resist; Developers & Ancillaries (incl. Adhesion promoter (HMDS); Primer; Anti-Reflective Coat
                                        
                                    
                                
                            
                                
                                    307 Materials, Process
                                    
                                
                                
                                        - Photo Masks; Finished or Patterned
                                        
                                    
                                
                            
                                
                                    701 Manufacturing Services or Consulting
                                    
                                
                                
                                        - Wafer Handling
                                        
                                    
                                
                            
                                
                                    903 LED
                                    
                                
                                
                                        - High-Brightness LED and High-Powered Devices
                                        
                                    
                                        - OLED Related Equipment and Materials, Panel and Module