With continuous and concentrated research and development, we create new values in the semiconductors and display manufacturing equipment fields.
AP Systems entered the semiconductor equipment market based on our accumulated knowhow on equipment control software. Since then, we have expanded into mid to small-sized LCD equipment, semiconductor processing equipment for 300mm wafers, and large-sized LCDs, and are currently leading the fields of ELA (Excimer Laser Annealing), LLO (Laser Lift-Off), and OLED Encapsulation, which are the laser equipment necessary for the production of OLED panels. We will continue to grow as a world-renowned total equipment company through endless development based on Top Spirit, Professional Spirit, and Venture Spirit.
Product Categories
200 Equipment, Assembly
- Cleaning; Washing Equipment for Assembly & Packaging
- Dispensing Systems
- Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment
- Wafer Level Bonders
203 Equipment, Inspection & Measurement
- Defect; Particle; Bump; Contamination Detection, Review or Inspection
204 Equipment, Mems
- Deep RIE etching; Dry Etching
- Wafer Level Bonders
207 Equipment, Process
- Coat; Develop; Resist Processing; Track Equipment
- Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
- Etching; Stripping; Ashing - Dry and Wet Equipment
- Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment