Introduction of the original process `ROKKO puremium process` turned to the visitor troubled by knife-edge or the cleanning factor on the back of a pattern (particle and contamination) while thinning processing of the wafer for power and sensors progressed,Back grind ojf 6-inch SiC and sapphire wafer,polish(CMP),proposal of washing technology.
Product Categories
- Chemical Mechanical Polishing (CMP); Electro Polishing, Mechanical Polishing Equipment
- Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
- Etching; Stripping; Ashing - Dry and Wet Equipment
- Wafer Identification; Marking Equipment