Woowon Technology Co., Ltd., established in 1990, is a Representative and Distributor for major foreign equipment suppliers. Our highly experienced sales and support teams of over forty people provide world-class support that is focused on delighting both our Principals and Customers. The Headquarters is located in Bundang-gu, Seongnam-si and we have second office in Hwasung-si and third office in Icheon-si ensuring fast and effective operations.
Woowon imports and supplies equipment from about thirty manufacturers based all over the World. We understand the unique company culture and local language to enable us to provide effective Equipment Sales, Logistics, Tool Installation and Start-up, Process Support, and Warranty Service. Our strong established network and highly capable team enable early market introduction of cutting edge technologies for our principals. Every day we leverage our twenty five years of high technology experience to satisfy the needs of our customers.
C&D Semi, Gudeng, Kin Lai, MPI, Raith, HSEB, Metryx, Neocera, ONDA, PVA AS, PVA MPS, Qoniac, scia, Verity,
Research Instrument, Oxford, SET, Rave, NXQ, Bruker, Capres, KOBUS
Product Categories
200 Equipment, Assembly
- Die Bonding; Attach Equipment
- Marking; Imprinting; Labeling Equipment
- Wire Bonding Equipment
203 Equipment, Inspection & Measurement
- Defect; Particle; Bump; Contamination Detection, Review or Inspection
- Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
- X-ray; XRF; 3-D X-Ray; LEXES Systems
204 Equipment, Mems
- Deep RIE etching; Dry Etching
206 PV Equipment
- Inspection and Metrology
- Thin Film
207 Equipment, Process
- Bumping Systems
- Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
- Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
- Etching; Stripping; Ashing - Dry and Wet Equipment
- Ion; E-Beam Milling Etching Equipment
208 Equipment, Test
- Probing Equipment incl. Analytical; Circuit; Manual; E-Beam; Optical; Wafer Probers
300 Materials, Assembly
- Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
305 Materials, Nanotechnology
- Materials, Nanotechnology
307 Materials, Process
- CMP; Grind; Lap; Polish; Abrasive materials
- Photo Masks; Finished or Patterned
309 Materials, Test
- Probe Cards; DUT boards and other probing accessories (incl Ceramic and Special Purpose Probe Cards)
401 Sub-systems
- Process Monitoring systems
700 Manufacturing Services
- Lithography; Patterning service
701 Manufacturing Services or Consulting
- Wafer Handling
804 Professional Services
- Purchasing; Procurement; Materials; Supply Chain Management Services
- Sales; Manufacturers Representation or Distributors
903 LED
- LED Manufacturing Material and testing Instruments
- Micro Display Panel and Other Flad Panel Display
- OLED Related Equipment and Materials, Panel and Module